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CD74HC273MG4

Texas Instruments

CD74HC273MG4 by Texas Instruments

CD74HC273MG4 by Texas Instruments is an 8-bit latch with a propagation delay of 45ns, operating at a supply voltage range of 2-6V. It features positive edge triggering and can handle a max frequency of 20MHz. Ideal for military-grade applications requiring fast data storage and retrieval in compact electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,880 parts In-Stock

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2,880

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Digiode

USA . 725 parts In-Stock

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725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,959 parts In-Stock

1+ parts

$10.014

100+ parts

-

1k+ parts

$10.574

10k+ parts

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1,959

$10.014

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$10.574

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DigiPath Technology Company

USA . 1,106 parts In-Stock

1+ parts

$11.027

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1,106

$11.027

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IDEA Electronic Components Group

UK . 1,643 parts In-Stock

1+ parts

$11.252

100+ parts

$10.689

1k+ parts

$10.127

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1,643

$11.252

$10.689

$10.127

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ChromeModa Solutions

Germany . 274 parts In-Stock

1+ parts

$11.252

100+ parts

$9.227

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-

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274

$11.252

$9.227

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AZTECH Wire

Italy . 728 parts In-Stock

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$14.207

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728

$14.207

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One Stop Electronics

USA . 797 parts In-Stock

1+ parts

$19.000

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797

$19.000

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Component Stockers USA

USA . 495 parts In-Stock

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$99.990

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495

$99.990

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Native Components

USA . 242 parts In-Stock

1+ parts

$291.220

100+ parts

$285.396

1k+ parts

$282.483

10k+ parts

$279.571

242

$291.220

$285.396

$282.483

$279.571

Northwest PG Solutions

USA . 1,258 parts In-Stock

1+ parts

$320.342

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1,258

$320.342

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Microchip USA

USA . 4,844 parts In-Stock

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Corphita

USA . 2,303 parts In-Stock

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Overview

Experience unmatched quality and reliability with the CD74HC273MG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch latches & flip-flops like this one, perfect for a wide range of applications. With fast propagation delay, low power consumption, and durable plastic/epoxy package body material, this product offers exceptional value and performance. Trust Texas Instruments to provide you with the best-in-class components for your projects, ensuring efficiency and reliability every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, ensuring the latch or flip-flop can withstand varying environmental conditions.

Propagation Delay At Nominal Supply: 45 ns

Fast propagation delay allows for quick response times, making the latch or flip-flop suitable for high-speed applications.

Surface Mount: YES

Ease of installation and space-saving design make this latch or flip-flop suitable for compact electronic devices.

Nominal Supply Voltage: 4.5 V

Operates efficiently at a moderate supply voltage, balancing power consumption and performance.

Maximum Operating Temperature: 125 °C

Wide temperature range enables the latch or flip-flop to function reliably in various industrial or military environments.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperatures, making it suitable for applications where cold conditions are a concern.

Technical Specifications

Latches & Flip-Flops CD74HC273MG4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

23 MHz

Trade Compliance

CD74HC273MG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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