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CD74HC237PWG4

Texas Instruments

CD74HC237PWG4 by Texas Instruments

CD74HC237PWG4 by Texas Instruments is a 16-terminal decoder with a propagation delay of 48 ns and load capacitance of 50 pF. It operates at a supply voltage range of 2-6V, suitable for military-grade applications requiring fast signal decoding in compact spaces. The surface-mount package with latched input conditioning makes it ideal for high-speed electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,491 parts In-Stock

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Digiode

USA . 1,067 parts In-Stock

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Native Components

USA . 963 parts In-Stock

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$0.894

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$0.894

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Northwest PG Solutions

USA . 1,416 parts In-Stock

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$0.984

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AZTECH Wire

Italy . 870 parts In-Stock

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$18.424

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Parana Technologies

USA . 1,044 parts In-Stock

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$18.698

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$18.791

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DigiPath Technology Company

USA . 483 parts In-Stock

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$20.589

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$18.942

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483

$20.589

$18.942

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ChromeModa Solutions

Germany . 5,677 parts In-Stock

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$21.009

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$17.227

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$21.009

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IDEA Electronic Components Group

UK . 1,419 parts In-Stock

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$21.009

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$19.959

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$18.908

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One Stop Electronics

USA . 1,007 parts In-Stock

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Microchip USA

USA . 5,115 parts In-Stock

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Corphita

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74HC237PWG4 decoder & driver. This versatile component offers seamless integration, fast propagation delay, and low power consumption, making it ideal for a wide range of applications. From automotive to industrial control systems, this product provides value and efficiency that exceed expectations. Trust Texas Instruments for cutting-edge technology and unparalleled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 48 ns

Low propagation delay allows for fast signal processing, making this decoder and driver efficient in data transmission.

Surface Mount: YES

Allows for easy installation and space-saving on circuit boards.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at an optimal voltage level, ensuring stable performance.

No. of Terminals: 16

Provides flexibility in connecting multiple input and output devices.

Output Polarity: TRUE

Ensures correct logic levels in the output signals, enhancing the reliability of the product.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Decoder & Drivers CD74HC237PWG4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ADDRESS LATCHES; 3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

48 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HC237PWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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