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CD74HC153EE4

Texas Instruments

CD74HC153EE4 by Texas Instruments

CD74HC153EE4 by Texas Instruments is a CMOS multiplexer/demultiplexer with 2 functions, 4 inputs, and 4 bits. It has a propagation delay of 40 ns at 4.5V supply voltage. Ideal for military applications due to its temperature grade and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,934 parts In-Stock

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Digiode

USA . 1,051 parts In-Stock

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Northwest PG Solutions

USA . 294 parts In-Stock

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$3.281

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AZTECH Wire

Italy . 510 parts In-Stock

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Parana Technologies

USA . 582 parts In-Stock

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$16.913

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ChromeModa Solutions

Germany . 1,953 parts In-Stock

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$19.003

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IDEA Electronic Components Group

UK . 138 parts In-Stock

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$18.053

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One Stop Electronics

USA . 781 parts In-Stock

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$41.000

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Corphita

USA . 2,377 parts In-Stock

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Microchip USA

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Native Components

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DigiPath Technology Company

USA . 298 parts In-Stock

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Overview

Experience the power of Texas Instruments with the CD74HC153EE4 multiplexer & demultiplexer. This versatile component offers high-quality performance and reliability, making it a top choice for a wide range of applications. With its 2 functions, 4 inputs, and fast propagation delay, this product delivers exceptional value and benefits to customers looking for efficient signal routing solutions. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 40 ns

This low propagation delay ensures fast signal processing, making this product suitable for applications requiring quick response times.

No. of Functions: 2

Having 2 functions in one device provides versatility and flexibility in design and usage of the multiplexer/demultiplexer.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V is within a common range for many electronic systems, making integration of this multiplexer/demultiplexer easier.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this product to be used in a wide range of environmental conditions without sacrificing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this multiplexer/demultiplexer efficient and reliable in various applications.

Technical Specifications

Multiplexer & Demultiplexer CD74HC153EE4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

4

No. of Functions:

2

No. of Inputs:

4

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

40 ns

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HC153EE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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