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CD74ACT373M96E4

Texas Instruments

CD74ACT373M96E4 by Texas Instruments

CD74ACT373M96E4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10.4 ns at 5V, suitable for military-grade applications. It features a small outline package, 3-STATE output characteristics, and operates within a temperature range of -55 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,600 parts In-Stock

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2,600

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Digiode

USA . 1,931 parts In-Stock

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1,931

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,280 parts In-Stock

1+ parts

$2.272

100+ parts

-

1k+ parts

$2.181

10k+ parts

$2.181

1,280

$2.272

-

$2.181

$2.181

AZTECH Wire

Italy . 775 parts In-Stock

1+ parts

$8.384

100+ parts

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775

$8.384

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Parana Technologies

USA . 1,644 parts In-Stock

1+ parts

$9.529

100+ parts

$884.934

1k+ parts

$8.576

10k+ parts

-

1,644

$9.529

$884.934

$8.576

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DigiPath Technology Company

USA . 1,531 parts In-Stock

1+ parts

$10.493

100+ parts

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1,531

$10.493

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Native Components

USA . 170 parts In-Stock

1+ parts

$10.670

100+ parts

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170

$10.670

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ChromeModa Solutions

Germany . 4,612 parts In-Stock

1+ parts

$10.707

100+ parts

$8.780

1k+ parts

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4,612

$10.707

$8.780

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IDEA Electronic Components Group

UK . 46 parts In-Stock

1+ parts

$10.707

100+ parts

$10.172

1k+ parts

$9.636

10k+ parts

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46

$10.707

$10.172

$9.636

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Northwest PG Solutions

USA . 2,017 parts In-Stock

1+ parts

$11.737

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$10.563

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2,017

$11.737

$10.563

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One Stop Electronics

USA . 1,211 parts In-Stock

1+ parts

$16.000

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1,211

$16.000

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QUARKTWIN TECHNOLOGY LTD

USA . 5,829 parts In-Stock

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5,829

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Corphita

USA . 3,187 parts In-Stock

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Microchip USA

USA . 2,755 parts In-Stock

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2,755

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Overview

Experience top-notch quality and reliability with the CD74ACT373M96E4 by Texas Instruments, a leading manufacturer in the industry. This Bus Driver & Transceiver is versatile and efficient, perfect for a wide range of applications. With a fast propagation delay and 3-STATE output characteristics, this product ensures smooth operation and seamless communication. Trust in Texas Instruments for cutting-edge technology and superior performance. Upgrade your projects with the CD74ACT373M96E4 and enjoy unmatched value and benefits that will elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for transportation applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 10.4 ns

Low propagation delay ensures fast signal transmission, making this product efficient for high-speed data communication in bus systems.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape helps in easy placement and alignment on the circuit board, ensuring proper functioning of the product.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of electronic systems and power sources.

Load Capacitance (CL): 50 pF

Optimal load capacitance value ensures stable and efficient signal transmission, enhancing the overall performance of the product.

Power Supplies (V): 5

Consistent power supply at 5V ensures reliable operation and prevents voltage fluctuations that could affect the performance of the product.

No. of Terminals: 20

Sufficient number of terminals for connecting multiple components and peripherals, enabling enhanced functionality and versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, allowing for compact and efficient design of electronic systems.

Maximum I (ol): 24 Amp

High output current capacity supports robust signal transmission and ensures compatibility with a wide range of devices and components.

Propagation Delay (tpd): 12.5 ns

Low propagation delay ensures fast response times, reducing latency and improving overall system efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Wide temperature range enables operation in extreme cold conditions, making the product versatile and suitable for a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel-Palladium-Gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: DUAL

Dual terminal position allows for flexible placement and connectivity options, accommodating different circuit board layouts and design configurations.

No. of Ports: 2

Dual ports provide connectivity options for multiple devices or systems, enabling efficient data transmission and communication.

Maximum Seated Height: 2.65 mm

Low seated height saves space on the circuit board and allows for compact design, ideal for applications where size constraints are critical.

Width: 7.5 mm

Narrow width facilitates easy integration into tight spaces and dense electronic assemblies, enhancing the product's flexibility and versatility.

Output Polarity: TRUE

True output polarity ensures correct signal interpretation and compatibility with standard communication protocols, enhancing interoperability with other devices.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for operation in low-power systems, conserving energy and extending battery life.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during assembly, ensuring proper connections and preventing damage to the product.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables soldering in high-temperature environments, ensuring secure and durable connections.

Length: 12.8 mm

Compact length design saves space on the circuit board, enabling efficient layout and integration in electronic systems.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in extreme conditions and harsh environments, making the product suitable for rugged applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the product's efficiency and reliability in electronic systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and resistance to mechanical stress, ensuring long-lasting performance in demanding applications.

Packing Method: TR

TR packing method offers convenient handling and storage, protecting the product during transportation and assembly processes.

Terminal Pitch: 1.27 mm

Optimal terminal pitch provides compatibility with standard circuit board layouts and facilitates easy installation and connection.

Count Direction: UNIDIRECTIONAL

Unidirectional count direction simplifies signal processing and ensures consistent and reliable data transmission in a single direction.

Control Type: ENABLE LOW/HIGH

Enable Low/High control type allows for flexible operation and configuration options, enabling user-defined settings and functionality.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage tolerance ensures protection against voltage spikes and fluctuations, enhancing the product's durability and reliability.

Maximum Power Supply Current (ICC): 0.16 mA

Low power supply current consumption minimizes energy usage and heat dissipation, making the product energy-efficient and cost-effective.

Technical Specifications

Bus Driver & Transceivers CD74ACT373M96E4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

ACT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

10.4 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

CD74ACT373M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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