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CD74AC280M96G4

Texas Instruments

CD74AC280M96G4 by Texas Instruments

CD74AC280M96G4 by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 19.1 ns at 3.3V, suitable for military-grade applications. It features a small outline package style, surface mount capability, and operates within a temperature range of -55 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,674 parts In-Stock

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Vyrian

USA . 2,458 parts In-Stock

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Andel Nordic

Denmark . 1,780 parts In-Stock

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$2.229

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$2.140

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$2.140

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$2.229

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$2.140

AZTECH Wire

Italy . 690 parts In-Stock

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$16.055

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690

$16.055

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Parana Technologies

USA . 1,704 parts In-Stock

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$16.243

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$1,508.445

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$14.619

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$1,508.445

$14.619

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DigiPath Technology Company

USA . 2,313 parts In-Stock

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$17.886

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$16.455

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ChromeModa Solutions

Germany . 3,073 parts In-Stock

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$18.251

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$14.966

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$14.966

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IDEA Electronic Components Group

UK . 1,776 parts In-Stock

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$18.251

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$17.338

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$16.426

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One Stop Electronics

USA . 248 parts In-Stock

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$48.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,806 parts In-Stock

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Microchip USA

USA . 4,012 parts In-Stock

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Corphita

USA . 3,842 parts In-Stock

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Perfect Parts

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Northwest PG Solutions

USA . 2,325 parts In-Stock

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Native Components

USA . 693 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the CD74AC280M96G4 by Texas Instruments. Known for their top-quality manufacturing, Texas Instruments offers a reliable product that boasts a fast propagation delay of 19.1 ns and a wide power supply range of 1.5-5.5V. Ideal for applications requiring precision and efficiency, this small outline package is perfect for military-grade projects where reliability is key. Trust Texas Instruments to deliver high-performance components that meet your demands and exceed your expectations. Upgrade your circuits today with the CD74AC280M96G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Propagation Delay At Nominal Supply: 19.1 ns

The low propagation delay ensures fast processing speeds and efficient operation of the digital arithmetic circuits.

Surface Mount: YES

Being surface mountable, the circuits can be easily integrated onto printed circuit boards, saving space and improving manufacturability.

No. of Bits: 9

With 9 bits, the circuits can handle a wide range of numerical operations with high precision and accuracy.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V provides a balanced and efficient power source for the circuits' operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the circuits can withstand harsh environmental conditions and operate reliably in various settings.

Technology: CMOS

The CMOS technology used in the circuits ensures low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Digital Arithmetic Circuits CD74AC280M96G4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

75 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/5.5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

19.1 ns

Propagation Delay (tpd):

263 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74AC280M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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