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CD74AC174M96E4

Texas Instruments

CD74AC174M96E4 by Texas Instruments

CD74AC174M96E4 by Texas Instruments is a 6-bit latch with 18.9 ns propagation delay, suitable for military applications. Operating at a max frequency of 68 MHz, it has a supply voltage range of 1.5V to 5.5V and can handle load capacitance up to 50 pF. This surface-mount device features positive edge triggering and is ideal for high-speed digital systems requiring fast data storage capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,826 parts In-Stock

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Digiode

USA . 3,137 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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AZTECH Wire

Italy . 848 parts In-Stock

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$6.046

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Parana Technologies

USA . 142 parts In-Stock

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$15.750

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$16.111

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DigiPath Technology Company

USA . 1,231 parts In-Stock

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$17.343

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ChromeModa Solutions

Germany . 4,865 parts In-Stock

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$17.697

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$14.512

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IDEA Electronic Components Group

UK . 1,475 parts In-Stock

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$17.697

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$16.812

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$15.927

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One Stop Electronics

USA . 1,546 parts In-Stock

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$46.000

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Ampacity Inc.

Singapore . 129 parts In-Stock

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$56.000

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Component Stockers USA

USA . 716 parts In-Stock

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Continental Prestige Electronics

USA . 6,575 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,406 parts In-Stock

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Microchip USA

USA . 4,794 parts In-Stock

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Argo Parts USA

USA . 4,195 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments CD74AC174M96E4 Latches & Flip-Flops. Crafted by a renowned manufacturer, this product offers unparalleled quality and reliability for a wide range of applications. Experience lightning-fast performance and seamless functionality with the innovative design of this product. Elevate your projects to new heights with the superior value and benefits that the CD74AC174M96E4 provides, setting you apart from the competition. Trust in Texas Instruments to deliver excellence every time, revolutionizing the way you work.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 18.9 ns

Low propagation delay ensures fast response time, making this product suitable for applications requiring quick switching.

No. of Bits: 6

6 bits provide sufficient resolution and flexibility for various digital applications.

Nominal Supply Voltage / Vsup: 3.3V

Operates at a common supply voltage, making it compatible with many electronic systems.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable connections and longevity of the product.

Temperature Grade: MILITARY

Designed to meet stringent military specifications for ruggedness and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Latches & Flip-Flops CD74AC174M96E4 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

68000000 Hz

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

18.9 ns

Propagation Delay (tpd):

169 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.91 mm

Minimum fmax:

68 MHz

Trade Compliance

CD74AC174M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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