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CD74AC02ME4

Texas Instruments

CD74AC02ME4 by Texas Instruments

CD74AC02ME4 by Texas Instruments is a logic gate with 4 functions and 2 inputs. It has a propagation delay of 16.1 ns at 3.3V, making it suitable for high-speed applications. With a small outline package style and military temperature grade, it is ideal for compact and rugged electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,474 parts In-Stock

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Digiode

USA . 4,793 parts In-Stock

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Nova Conductors

Japan . 33 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 978 parts In-Stock

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$3.000

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978

$3.000

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AZTECH Wire

Italy . 417 parts In-Stock

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$12.332

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417

$12.332

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Parana Technologies

USA . 917 parts In-Stock

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$12.933

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$1,201.070

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$11.640

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917

$12.933

$1,201.070

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DigiPath Technology Company

USA . 884 parts In-Stock

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$14.241

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$13.102

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884

$14.241

$13.102

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ChromeModa Solutions

Germany . 4,115 parts In-Stock

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$14.532

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$11.916

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$14.532

$11.916

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IDEA Electronic Components Group

UK . 1,148 parts In-Stock

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$14.532

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$13.805

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$13.079

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$14.532

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$13.079

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One Stop Electronics

USA . 1,517 parts In-Stock

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$16.000

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QUARKTWIN TECHNOLOGY LTD

USA . 9,887 parts In-Stock

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Microchip USA

USA . 4,921 parts In-Stock

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Argo Parts USA

USA . 2,319 parts In-Stock

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Corphita

USA . 2,273 parts In-Stock

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Continental Prestige Electronics

USA . 2,102 parts In-Stock

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Bastille Electronics

Australia . 600 parts In-Stock

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Overview

Elevate your projects with the CD74AC02ME4 by Texas Instruments, a top-tier logic gate that delivers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this logic gate boasts 4 functions and 2 inputs, making it ideal for a wide range of applications. With a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C, this product offers outstanding performance in any environment. Trust in Texas Instruments to provide cutting-edge technology and exceptional value with the CD74AC02ME4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 16.1 ns

Low propagation delay ensures quick response times, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

No. of Functions: 4

Having 4 functions in a single logic gate chip increases integration and saves board space in electronic designs.

No. of Inputs: 2

Having 2 inputs allows for basic logic operations to be performed, providing versatility in circuit design.

Nominal Supply Voltage / Vsup: 3.3V

Operating at a common supply voltage of 3.3V makes it compatible with a wide range of microcontrollers and digital systems.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable operation and compatibility with various external components in the circuit.

Power Supplies (V): 3.3/5

Support for dual power supply voltages (3.3V and 5V) offers flexibility in different types of electronic systems.

Maximum Operating Temperature: 125°C

High maximum operating temperature allows for reliable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gate efficient and reliable.

Technical Specifications

Logic Gates CD74AC02ME4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

16.1 ns

Propagation Delay (tpd):

144 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.91 mm

Trade Compliance

CD74AC02ME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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