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CD4076BM96

Texas Instruments

CD4076BM96 by Texas Instruments

CD4076BM96 by Texas Instruments is a 4-bit latch with 600 ns propagation delay, operating at -55 to 125 °C. It has a true output polarity and supports a max frequency of 3 MHz. Ideal for military applications requiring positive edge triggering in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,231 parts In-Stock

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Digiode

USA . 799 parts In-Stock

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799

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Distributors (Availability)

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Native Components

USA . 142 parts In-Stock

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$0.452

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-

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$0.434

142

$0.452

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$0.434

Northwest PG Solutions

USA . 675 parts In-Stock

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$0.498

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$0.439

675

$0.498

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$0.439

Parana Technologies

USA . 120 parts In-Stock

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$10.774

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$11.259

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120

$10.774

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$11.259

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DigiPath Technology Company

USA . 1,737 parts In-Stock

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$11.864

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1,737

$11.864

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ChromeModa Solutions

Germany . 6,410 parts In-Stock

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$12.106

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$9.927

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6,410

$12.106

$9.927

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IDEA Electronic Components Group

UK . 1,533 parts In-Stock

1+ parts

$12.106

100+ parts

$11.501

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$10.895

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1,533

$12.106

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$10.895

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AZTECH Wire

Italy . 447 parts In-Stock

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$14.733

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447

$14.733

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One Stop Electronics

USA . 259 parts In-Stock

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$43.000

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$43.000

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Component Stockers USA

USA . 643 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 2,208 parts In-Stock

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Microchip USA

USA . 182 parts In-Stock

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Overview

Discover the unparalleled reliability and innovation of Texas Instruments with the CD4076BM96 latches & flip-flops. This versatile component offers a seamless integration into various applications, providing customers with a quality product that delivers exceptional performance. With a focus on value and efficiency, Texas Instruments ensures that every interaction with the CD4076BM96 brings unmatched benefits and advantages to your projects. Trust in Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes installation easier and allows for compact designs.

No. of Bits: 4

Having 4 bits increases the functionality and versatility of this latch and flip-flop.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage makes it compatible with standard power sources.

Propagation Delay (tpd): 600 ns

With a low propagation delay of 600 ns, this latch and flip-flop ensures fast and efficient operation.

Temperature Grade: MILITARY

The military-grade temperature range allows this product to withstand extreme environmental conditions.

Maximum Frequency At Nominal Supply: 3000000 Hz

The high maximum frequency makes this latch and flip-flop suitable for high-speed applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity.

Technical Specifications

Latches & Flip-Flops CD4076BM96 attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

8 MHz

Trade Compliance

CD4076BM96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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