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CD4034BM96

Texas Instruments

CD4034BM96 by Texas Instruments

CD4034BM96 by Texas Instruments is an 8-bit digital shift register with a propagation delay of 700 ns and a max frequency of 2 MHz. It operates at temperatures ranging from -55 to 125°C, making it suitable for military-grade applications requiring high-speed data shifting in compact spaces. With true output polarity and 3-state characteristics, this CMOS technology-based shift register is ideal for bidirectional count direction control in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,779 parts In-Stock

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Digiode

USA . 3,727 parts In-Stock

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Parana Technologies

USA . 1,025 parts In-Stock

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$15.164

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$15.565

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ChromeModa Solutions

Germany . 6,454 parts In-Stock

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$17.038

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$13.971

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IDEA Electronic Components Group

UK . 592 parts In-Stock

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$17.038

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$16.186

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$15.334

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592

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AZTECH Wire

Italy . 484 parts In-Stock

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$18.685

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One Stop Electronics

USA . 1,370 parts In-Stock

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$65.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

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DigiPath Technology Company

USA . 1,224 parts In-Stock

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$15.361

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Northwest PG Solutions

USA . 1,000 parts In-Stock

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Native Components

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Microchip USA

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Overview

Elevate the performance of your digital shift register applications with the CD4034BM96 by Texas Instruments. Made with high-quality materials and advanced CMOS technology, this 8-bit shift register offers reliable operation and precise results. Whether you're working on military-grade projects or high-frequency applications, this versatile device ensures seamless functionality with its true output polarity and positive edge trigger type. Experience the value of enhanced efficiency and accuracy in your designs with the CD4034BM96 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or hand-held devices.

No. of Bits: 8

Having 8 bits allows for a wide range of digital operations and data processing capabilities.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage is common and readily available, making integration into existing systems easier.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain stability.

Output Characteristics: 3-STATE

The 3-STATE output allows for high flexibility and control in managing the output signal state.

Technical Specifications

Digital Shift Registers CD4034BM96 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Additional Features:

COMMON I/O PINS, SERIAL INPUT-PARALLEL OUTPUT AND SERIAL INPUT-SERIAL OUTPUT OPERATION AVAILABLE

Count Direction:

BIDIRECTIONAL

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

700 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

7 MHz

Trade Compliance

CD4034BM96 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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