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CD74HC595MTG4

Texas Instruments

CD74HC595MTG4 by Texas Instruments

CD74HC595MTG4 by Texas Instruments is an 8-bit digital shift register with a propagation delay of 300 ns. It operates at a nominal voltage of 5V and has a max frequency of 25 MHz. Ideal for applications requiring positive edge trigger, such as military-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,785 parts In-Stock

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Digiode

USA . 1,795 parts In-Stock

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1,795

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Nova Conductors

Japan . 150 parts In-Stock

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150

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AZTECH Wire

Italy . 865 parts In-Stock

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$11.488

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Parana Technologies

USA . 315 parts In-Stock

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$17.352

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$17.560

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315

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DigiPath Technology Company

USA . 238 parts In-Stock

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$19.107

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$17.578

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

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$19.497

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$18.522

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$17.547

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$19.497

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ChromeModa Solutions

Germany . 921 parts In-Stock

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$19.497

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$15.988

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Corohmni

South Africa . 554 parts In-Stock

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$23.755

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One Stop Electronics

USA . 1,539 parts In-Stock

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$35.000

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Ampacity Inc.

Singapore . 1,055 parts In-Stock

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$43.000

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Continental Prestige Electronics

USA . 3,827 parts In-Stock

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Argo Parts USA

USA . 3,322 parts In-Stock

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Corphita

USA . 3,259 parts In-Stock

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Perfect Parts

USA . 750 parts In-Stock

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Advanced Electronics

New Zealand . 33 parts In-Stock

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Bastille Electronics

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Overview

Elevate your digital shift register experience with the CD74HC595MTG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers once again with this small outline package that boasts 8 bits of power. Whether you're working on industrial automation, sensor interfacing, or LED matrix displays, this versatile component offers a wide range of applications. With a nominal supply voltage of 5V and a military-grade temperature range, the CD74HC595MTG4 provides unmatched value and performance for all your electronic projects. Upgrade your designs today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and can withstand a range of operating temperatures, making the product reliable for various applications.

No. of Bits: 8

With 8 bits, this shift register can handle a reasonable amount of data processing efficiently, suitable for many digital applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for multiple devices to share the same output line without interfering with each other, enhancing the product's versatility in system design.

Maximum Frequency At Nominal Supply: 25000000 Hz

The high maximum frequency capability enables fast data processing, making this shift register ideal for applications requiring high-speed operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noise-sensitive environments.

Technical Specifications

Digital Shift Registers CD74HC595MTG4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

25000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Shift Register

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Minimum fmax:

25 MHz

Trade Compliance

CD74HC595MTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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