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SN74LS95BJ4

Texas Instruments

SN74LS95BJ4 by Texas Instruments

SN74LS95BJ4 by Texas Instruments is a 4-bit digital shift register with TTL technology. It operates at 5V, has 14 terminals in an in-line package style, and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring serial data transfer and storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,937 parts In-Stock

1+ parts

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4,937

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Digiode

USA . 2,120 parts In-Stock

1+ parts

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2,120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 550 parts In-Stock

1+ parts

$18.055

100+ parts

-

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550

$18.055

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Parana Technologies

USA . 676 parts In-Stock

1+ parts

$28.379

100+ parts

-

1k+ parts

$46.790

10k+ parts

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676

$28.379

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$46.790

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DigiPath Technology Company

USA . 2,008 parts In-Stock

1+ parts

$31.249

100+ parts

$28.749

1k+ parts

-

10k+ parts

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2,008

$31.249

$28.749

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ChromeModa Solutions

Germany . 4,290 parts In-Stock

1+ parts

$31.887

100+ parts

$26.147

1k+ parts

-

10k+ parts

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4,290

$31.887

$26.147

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IDEA Electronic Components Group

UK . 2,241 parts In-Stock

1+ parts

$31.887

100+ parts

$30.293

1k+ parts

$28.698

10k+ parts

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2,241

$31.887

$30.293

$28.698

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One Stop Electronics

USA . 249 parts In-Stock

1+ parts

$36.000

100+ parts

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249

$36.000

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Corphita

USA . 4,996 parts In-Stock

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4,996

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Overview

Enhance your digital design projects with the SN74LS95BJ4 by Texas Instruments, a top-quality digital shift register that delivers unmatched performance and reliability. Texas Instruments is known for its cutting-edge technology and innovation, making this product a must-have for any tech enthusiast. Whether you're working on automation systems, data communication, or control circuits, the SN74LS95BJ4 offers seamless integration and superior functionality. Upgrade your projects today and experience the value and benefits that this exceptional product has to offer.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides good thermal conductivity and reliability, making the product durable and capable of handling high operating temperatures.

No. of Bits: 4

Having 4 bits allows for a moderate amount of data storage and manipulation, suitable for various digital applications without excessive complexity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes integration with other components easier and ensures compatibility in most electronic systems.

Terminal Pitch: 2.54 mm

With a standard terminal pitch, the product is easy to prototype and compatible with common through-hole components, simplifying circuit design and assembly.

Technology: TTL

Using TTL technology ensures high-speed data processing and low power consumption, making the product efficient and suitable for various digital applications.

Technical Specifications

Digital Shift Registers SN74LS95BJ4 attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Shift Registers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS95BJ4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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