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CD40175BPW

Texas Instruments

CD40175BPW by Texas Instruments

CD40175BPW by Texas Instruments is a 4-bit latch with 400 ns propagation delay, operating at -55 to 125 °C. It has a supply voltage of 5V, load capacitance of 50 pF, and can handle frequencies up to 2 MHz. Ideal for military-grade applications requiring positive edge triggering in a compact SOT-109 package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,297 parts In-Stock

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Digiode

USA . 1,637 parts In-Stock

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1,637

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,430 parts In-Stock

1+ parts

$3.497

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1,430

$3.497

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AZTECH Wire

Italy . 395 parts In-Stock

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$19.461

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395

$19.461

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Parana Technologies

USA . 337 parts In-Stock

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$23.516

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$24.149

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337

$23.516

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$24.149

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DigiPath Technology Company

USA . 170 parts In-Stock

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$25.894

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$23.822

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170

$25.894

$23.822

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ChromeModa Solutions

Germany . 6,060 parts In-Stock

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$26.422

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$21.666

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6,060

$26.422

$21.666

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IDEA Electronic Components Group

UK . 495 parts In-Stock

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$26.422

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$25.101

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$23.780

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495

$26.422

$25.101

$23.780

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One Stop Electronics

USA . 1,588 parts In-Stock

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$58.000

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$58.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 2,109 parts In-Stock

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2,109

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Native Components

USA . 660 parts In-Stock

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$3.084

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Microchip USA

USA . 448 parts In-Stock

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Overview

Unlock endless possibilities with the CD40175BPW from Texas Instruments, a leading manufacturer in latches & flip-flops. This versatile component offers superior quality and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers unmatched performance and efficiency. Experience seamless operation and enhanced functionality with the CD40175BPW, perfect for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection to the internal components of the latch or flip-flop, ensuring longevity and reliability of the product.

No. of Bits: 4

Having 4 bits allows for a higher range of data storage and processing capabilities, making the latch or flip-flop suitable for more complex applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this latch or flip-flop compatible with standard electronic systems, offering easy integration and usage.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this latch or flip-flop can be used in various environmental conditions without compromising its performance.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the latch or flip-flop in different applications.

Technical Specifications

Latches & Flip-Flops CD40175BPW attributes and parameters. Explore more Latches & Flip-Flops devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

6.5 MHz

Trade Compliance

CD40175BPW Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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