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CCZACC06A1RTCR

Texas Instruments

CCZACC06A1RTCR by Texas Instruments

CCZACC06A1RTCR by Texas Instruments is a CMOS chip carrier with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3V and is suitable for industrial applications requiring surface mount technology in plastic/epoxy packages.

Median Price

$13.225

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 312 parts In-Stock

1+ parts

$11.250

100+ parts

$10.580

1k+ parts

$9.560

10k+ parts

-

312

$11.250

$10.580

$9.560

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DigiKey

USA . 1,229 parts In-Stock

1+ parts

$17.140

100+ parts

$13.100

1k+ parts

$12.023

10k+ parts

$10.733

1,229

$17.140

$13.100

$12.023

$10.733

Verical

USA . 312 parts In-Stock

1+ parts

-

100+ parts

$13.225

1k+ parts

$11.950

10k+ parts

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312

-

$13.225

$11.950

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,130 parts In-Stock

1+ parts

$10.688

100+ parts

-

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2,130

$10.688

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Vyrian

USA . 2,330 parts In-Stock

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$11.250

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2,330

$11.250

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DigiKey Marketplace

USA . 312 parts In-Stock

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312

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 468 parts In-Stock

1+ parts

$0.471

100+ parts

-

1k+ parts

-

10k+ parts

$0.452

468

$0.471

-

-

$0.452

Northwest PG Solutions

USA . 629 parts In-Stock

1+ parts

$0.518

100+ parts

-

1k+ parts

-

10k+ parts

$0.457

629

$0.518

-

-

$0.457

Corphita

USA . 757 parts In-Stock

1+ parts

$10.125

100+ parts

-

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757

$10.125

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Corohmni

South Africa . 894 parts In-Stock

1+ parts

$15.915

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894

$15.915

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Parana Technologies

USA . 1,556 parts In-Stock

1+ parts

$38.087

100+ parts

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1,556

$38.087

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DigiPath Technology Company

USA . 1,186 parts In-Stock

1+ parts

$41.938

100+ parts

$38.583

1k+ parts

-

10k+ parts

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1,186

$41.938

$38.583

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ChromeModa Solutions

Germany . 4,062 parts In-Stock

1+ parts

$42.794

100+ parts

$35.091

1k+ parts

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4,062

$42.794

$35.091

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IDEA Electronic Components Group

UK . 2,292 parts In-Stock

1+ parts

$42.794

100+ parts

$40.654

1k+ parts

$38.515

10k+ parts

-

2,292

$42.794

$40.654

$38.515

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$54.104

100+ parts

$49.235

1k+ parts

$44.365

10k+ parts

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1,000

$54.104

$49.235

$44.365

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Kepictronics

USA . 50,000 parts In-Stock

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Perfect Parts

USA . 1,379 parts In-Stock

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1,379

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Futuretech Components

Singapore . 310 parts In-Stock

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310

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Overview

Unlock the power of cutting-edge technology with the CCZACC06A1RTCR by Texas Instruments. Crafted with precision and expertise, this versatile chip carrier offers unparalleled performance and reliability for a wide range of industrial applications. From enhancing automation processes to optimizing system efficiency, this innovative product delivers unmatched value and benefits to customers seeking top-of-the-line solutions. Upgrade your technology game today with Texas Instruments' superior quality ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the integrated circuit within.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it suitable for compact electronic devices.

Power Supplies (V): 3

The 3V power supply ensures compatibility with a wide range of applications and power sources.

No. of Terminals: 48

Having 48 terminals provides flexibility in connecting external components and peripherals, enhancing the product's functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and overall reliability in the connections.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the product can withstand elevated temperature environments without any performance issues.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the product to operate effectively in cold conditions as well.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the product can undergo reflow soldering processes effectively without any damage.

Temperature Grade: INDUSTRIAL

Having an industrial temperature grade ensures reliable performance in a wide range of temperature conditions typically found in industrial environments.

Technology: CMOS

The CMOS technology used in the product offers low power consumption, high speed, and versatile functionality, making it ideal for various applications.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures consistent and stable power delivery to the product, enhancing its overall reliability.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CCZACC06A1RTCR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CCZACC06A1RTCR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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