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CCZACC06A1RTC

Texas Instruments

CCZACC06A1RTC by Texas Instruments

CCZACC06A1RTC by Texas Instruments is a 48-terminal chip carrier IC with CMOS technology, operating at -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm, suitable for industrial applications requiring surface mount packaging in plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,626 parts In-Stock

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Digiode

USA . 3,738 parts In-Stock

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3,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 930 parts In-Stock

1+ parts

$0.102

100+ parts

-

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$0.098

930

$0.102

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$0.098

Northwest PG Solutions

USA . 91 parts In-Stock

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$0.112

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$0.099

91

$0.112

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$0.099

AZTECH Wire

Italy . 722 parts In-Stock

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$7.948

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722

$7.948

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One Stop Electronics

USA . 1,570 parts In-Stock

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$17.000

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1,570

$17.000

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Corohmni

South Africa . 25 parts In-Stock

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$19.463

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25

$19.463

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Parana Technologies

USA . 2,096 parts In-Stock

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$63.712

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2,096

$63.712

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DigiPath Technology Company

USA . 1,149 parts In-Stock

1+ parts

$70.155

100+ parts

$64.543

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$70.155

$64.543

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ChromeModa Solutions

Germany . 5,197 parts In-Stock

1+ parts

$71.587

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$58.701

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$71.587

$58.701

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IDEA Electronic Components Group

UK . 578 parts In-Stock

1+ parts

$71.587

100+ parts

$68.008

1k+ parts

$64.428

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578

$71.587

$68.008

$64.428

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Corphita

USA . 3,494 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 6 parts In-Stock

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Overview

Enhance your electronic projects with the CCZACC06A1RTC by Texas Instruments. Known for their high-quality products, Texas Instruments offers this versatile chip carrier package that is perfect for a wide range of applications in the field of Other Function uPs, uCs, and Peripheral ICs. With a strong focus on performance and reliability, this product provides customers with exceptional value and benefits. Upgrade your designs with the CCZACC06A1RTC and experience the advantages of Texas Instruments technology firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective, ideal for portable and budget-friendly applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient assembly on circuit boards, saving time and labor costs during production.

Package Shape: SQUARE

The square package shape provides a compact form factor, making the product suitable for space-constrained designs.

Power Supplies (V): 3

The 3V power supply ensures compatibility with a wide range of systems and devices, offering flexibility in application.

No. of Terminals: 48

The 48 terminals provide ample connectivity options, allowing for versatile integration and functionality within a circuit.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and durability, ensuring reliable operation in various environmental conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product can withstand extended use in demanding industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables the product to function effectively in cold environments without risk of damage or failure.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers corrosion resistance and reliable electrical connections, ensuring long-term performance and durability.

Terminal Position: QUAD

The quad terminal position provides stability and secure placement on the circuit board, reducing the risk of signal interference or disconnection.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for efficient and precise soldering during assembly, ensuring high-quality connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C enables reliable and consistent soldering of the product onto the circuit board, ensuring long-term reliability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions and temperature fluctuations commonly found in industrial environments.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for various applications.

Terminal Form: NO LEAD

The no lead terminal form is environmentally friendly and compliance with regulatory standards, making the product a sustainable choice for eco-conscious designs.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures compatibility with standard power sources, simplifying integration and reducing the need for external components.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for tight spacing and high-density packaging, making the product suitable for compact and miniaturized applications.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product is moderately sensitive to moisture exposure, requiring standard handling and storage procedures to maintain performance.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs CCZACC06A1RTC attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

CCZACC06A1RTC Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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