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CC1010PAGG3

Texas Instruments

CC1010PAGG3 by Texas Instruments

Texas Instruments CC1010PAGG3 microcontroller features CMOS technology, with peak reflow temp of 260°C and 30s max time. Ideal for applications requiring a MICROCONTROLLER with NICKEL PALLADIUM GOLD terminal finish, MSL level 3.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,488 parts In-Stock

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7,488

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Digiode

USA . 209 parts In-Stock

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209

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Native Components

USA . 226 parts In-Stock

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$5.085

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226

$5.085

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AZTECH Wire

Italy . 618 parts In-Stock

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$8.316

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618

$8.316

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Parana Technologies

USA . 2,239 parts In-Stock

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$26.486

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$27.063

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2,239

$26.486

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$27.063

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ChromeModa Solutions

Germany . 4,448 parts In-Stock

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$29.759

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$24.402

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4,448

$29.759

$24.402

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IDEA Electronic Components Group

UK . 1,037 parts In-Stock

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$29.759

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$28.271

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$26.783

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1,037

$29.759

$28.271

$26.783

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One Stop Electronics

USA . 1,588 parts In-Stock

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$33.000

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1,588

$33.000

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Component Stockers USA

USA . 541 parts In-Stock

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$99.990

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541

$99.990

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Northwest PG Solutions

USA . 951 parts In-Stock

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$4.983

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951

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$4.983

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Corphita

USA . 697 parts In-Stock

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DigiPath Technology Company

USA . 585 parts In-Stock

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$26.831

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585

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$26.831

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Overview

Unleash the power of innovation with the CC1010PAGG3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that push boundaries and exceed expectations. With endless applications in various industries, this advanced technology offers unparalleled value, benefits, and advantages to customers. Elevate your projects and streamline your processes with the CC1010PAGG3 - the ultimate solution for your microcontroller needs.

Feature Benefit Bullets

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes heat exposure, reducing the risk of component damage during assembly and extending the product's lifespan.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature soldering processes, making it suitable for various manufacturing environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates multiple peripheral functions in a single chip, offering compact design, lower power consumption, and enhanced control capabilities.

Technology: CMOS

Complementary metal-oxide-semiconductor (CMOS) technology used in this microcontroller provides low power consumption, high noise immunity, and faster switching speeds, making it efficient and reliable for various applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller is less prone to moisture-related issues during storage and handling, ensuring its reliability and performance over time.

Technical Specifications

Microcontrollers CC1010PAGG3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

CC1010PAGG3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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