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CC1010-STY1

Texas Instruments

CC1010-STY1 by Texas Instruments

The Texas Instruments CC1010-STY1 microcontroller features an 8-bit CPU with a max clock frequency of 24 MHz. With 26 I/O lines, it is suitable for industrial applications requiring ADC and PWM channels. Operating b/w -40 to 85°C, this CMOS technology-based device offers ROM programmability and DMA support.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,210 parts In-Stock

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Digiode

USA . 3,468 parts In-Stock

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EMSNET

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Northwest PG Solutions

USA . 2,264 parts In-Stock

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$3.168

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One Stop Electronics

USA . 586 parts In-Stock

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$5.000

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586

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AZTECH Wire

Italy . 473 parts In-Stock

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$15.850

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$15.850

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Parana Technologies

USA . 1,653 parts In-Stock

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$47.337

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DigiPath Technology Company

USA . 1,187 parts In-Stock

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$52.124

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ChromeModa Solutions

Germany . 2,880 parts In-Stock

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$53.188

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$43.614

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IDEA Electronic Components Group

UK . 558 parts In-Stock

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$53.188

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$50.529

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$47.869

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Corphita

USA . 4,131 parts In-Stock

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Native Components

USA . 178 parts In-Stock

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Overview

Discover the CC1010-STY1 by Texas Instruments, a top-quality microcontroller designed for a wide range of applications. With its advanced technology and reliable performance, this product offers unparalleled value to customers seeking efficiency and innovation. Experience the benefits of seamless integration, high-speed operation, and low power consumption, making it the ideal choice for industrial-grade projects. Trust in Texas Instruments' reputation for excellence and elevate your designs with the CC1010-STY1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power input options.

Package Shape: SQUARE

Square package shape helps in compact design layout and efficient use of space on the PCB.

Bit Size: 8

8-bit processing capability provides sufficient computing power for a variety of tasks.

Power Supplies (V): 3/3.3

Support for multiple power supply options offers flexibility in system design.

No. of Terminals: 64

Plenty of terminals provide ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The combination of these package styles ensures a compact and efficient design suitable for space-constrained applications.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a variety of environmental conditions.

CPU Family: 8051

8051 CPU family is well-known for its robust performance and wide industry support.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold environments.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the product's functionality.

DMA Channels: YES

Integrated DMA channels improve data transfer efficiency and offload the CPU for other tasks.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and connection management.

ROM Words: 32768

Large ROM capacity allows for storing a significant amount of program code and data.

Maximum Seated Height: 1.2 mm

Low seated height contributes to a slim and compact overall product design.

Width: 9.95 mm

Narrow width helps in saving space on the PCB and allows for dense packing of components.

Maximum Clock Frequency: 24 MHz

High clock frequency enables fast processing speeds for time-critical applications.

Length: 9.95 mm

Compact length contributes to space-saving design and efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product integrates various peripherals for added functionality and flexibility.

RAM Bytes: 2176

Generous RAM capacity allows for efficient data processing and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and enhances mechanical stability on the PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals for applications such as motor control and LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and supports miniaturization of the overall product design.

Speed: 24 rpm

With a maximum clock frequency of 24 MHz, the product offers high-speed processing for demanding applications.

No. of I/O Lines: 26

An adequate number of I/O lines provide versatile connectivity options for interfacing with external devices and sensors.

Technical Specifications

Microcontrollers CC1010-STY1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

9.95 mm

No. of I/O Lines:

26

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

2176

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9.95 mm

Peripheral IC Type:

Trade Compliance

CC1010-STY1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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