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CC1010-RTR1

Texas Instruments

CC1010-RTR1 by Texas Instruments

CC1010-RTR1 by Texas Instruments is an 8-bit microcontroller with a max clock frequency of 24 MHz. It features 2176 bytes of RAM, ADC and DMA channels, and ROM programmability via FLASH. Ideal for industrial applications requiring a compact design with 64 terminals in a flatpack package style.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

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Digiode

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Prism Electronics

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Native Components

USA . 265 parts In-Stock

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Northwest PG Solutions

USA . 2,310 parts In-Stock

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AZTECH Wire

Italy . 721 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

USA . 2,279 parts In-Stock

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ChromeModa Solutions

Germany . 1,457 parts In-Stock

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IDEA Electronic Components Group

UK . 696 parts In-Stock

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Lixinc

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Corphita

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Overview

Unlock a world of possibilities with the Texas Instruments CC1010-RTR1 microcontroller. From smart home devices to industrial automation, this powerful and reliable product offers unmatched quality and performance. With a trusted manufacturer like Texas Instruments, you can trust that you are getting a top-of-the-line product that meets all your needs. Experience seamless integration, high-speed processing, and versatile applications with the CC1010-RTR1. Elevate your projects with this exceptional microcontroller and unleash your creativity without compromise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for a variety of applications.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for accurate analog signal conversion, enhancing the versatility of the microcontroller.

DMA Channels: YES

Direct Memory Access channels enable efficient data transfer without CPU intervention, improving overall system performance.

Maximum Clock Frequency: 24 MHz

With a high clock frequency, this microcontroller can handle processing tasks quickly and efficiently, making it ideal for applications requiring fast data processing.

ROM Programmability: FLASH

Flash programmability enables easy and convenient updating of the microcontroller's firmware, allowing for flexibility and adaptability in various applications.

Technical Specifications

Microcontrollers CC1010-RTR1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

8051

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

9.95 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

RAM Bytes:

2176

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9.95 mm

Peripheral IC Type:

Trade Compliance

CC1010-RTR1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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