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BUF600AU

Texas Instruments

BUF600AU by Texas Instruments

BUF600AU by Texas Instruments is a buffer amplifier with 320 MHz bandwidth, 5 uA bias current, and 30,000 uV input offset voltage. Ideal for industrial applications requiring a small outline package and dual terminal position in temperature range of -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,552 parts In-Stock

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Digiode

USA . 4,023 parts In-Stock

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4,023

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Pegasus Components GmbH

Germany . 182 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 29 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 577 parts In-Stock

1+ parts

$1.752

100+ parts

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$2.326

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577

$1.752

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$2.326

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DigiPath Technology Company

USA . 2,351 parts In-Stock

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$1.930

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$1.930

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ChromeModa Solutions

Germany . 4,677 parts In-Stock

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$1.969

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$1.615

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$1.969

$1.615

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IDEA Electronic Components Group

UK . 42 parts In-Stock

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$1.969

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$1.772

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42

$1.969

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$1.772

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One Stop Electronics

USA . 1,075 parts In-Stock

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$3.410

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$3.410

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AZTECH Wire

Italy . 834 parts In-Stock

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$17.970

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834

$17.970

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A-Z Elektronik GmbH

Germany . 7,172 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,299 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

USA . 2,357 parts In-Stock

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Northwest PG Solutions

USA . 519 parts In-Stock

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$3.450

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519

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$3.450

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Native Components

USA . 292 parts In-Stock

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$3.414

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292

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$3.414

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Overview

Enhance your electronic projects with the BUF600AU by Texas Instruments, a high-quality buffer amplifier designed to deliver superior performance and reliability. Manufactured by a trusted industry leader, this product offers a wide range of applications in various fields. Experience the value of precise signal buffering and amplification, while benefiting from its compact design and flexible mounting options. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the BUF600AU today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protects the internal components from damage, making it a reliable choice for long-term use.

Maximum Input Offset Voltage: 30000 uV

The low maximum input offset voltage helps in minimizing inaccuracies in signal amplification, resulting in a more precise output signal.

Maximum Average Bias Current (IIB): 5 uA

The low maximum average bias current ensures minimal power consumption and heat generation, making the buffer amplifier energy-efficient.

Surface Mount: YES

Being surface mountable allows for easy integration into electronic circuits, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage is a common and stable power input, ensuring consistent performance of the buffer amplifier.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and compatibility with various circuit configurations.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the buffer amplifier can withstand challenging environmental conditions without performance degradation.

Technology: BIPOLAR

The bipolar technology used in this buffer amplifier offers high precision and low noise, making it suitable for applications requiring accurate signal processing.

Technical Specifications

Buffer Amplifiers BUF600AU attributes and parameters. Explore more Buffer Amplifiers devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

Bipolar

Total Functions:

1

Sub-Category:

Buffer Amplifiers

Performance Specifications

Nominal Bandwidth (3dB):

320 MHz

Nominal Slew Rate:

3400 V/us

Input Offset Voltage Limit:

30 mV

Peak Bias Current:

5 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Nominal Negative Supply Voltage (Vsup):

-5 V

Maximum Negative Supply Voltage:

-6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Style:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Trade Compliance

BUF600AU Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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