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BQ771811DPJT

Texas Instruments

BQ771811DPJT by Texas Instruments

BQ771811DPJT by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 85°C. It supports a supply voltage range of 3-25V and has a threshold voltage of +4.225V. Ideal for industrial applications requiring power supply support circuits in compact spaces due to its small outline package style.

Median Price

$1.854

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,450 parts In-Stock

1+ parts

$1.309

100+ parts

$1.007

1k+ parts

$0.530

10k+ parts

-

2,450

$1.309

$1.007

$0.530

-

Mouser Electronics

USA . 249 parts In-Stock

1+ parts

$2.400

100+ parts

$1.170

1k+ parts

$0.795

10k+ parts

$0.756

249

$2.400

$1.170

$0.795

$0.756

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,689 parts In-Stock

1+ parts

$1.244

100+ parts

-

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-

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4,689

$1.244

-

-

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Vyrian

USA . 4,288 parts In-Stock

1+ parts

-

100+ parts

-

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4,288

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 803 parts In-Stock

1+ parts

$1.110

100+ parts

$1.082

1k+ parts

$1.077

10k+ parts

-

803

$1.110

$1.082

$1.077

-

Ampacity Inc.

Singapore . 663 parts In-Stock

1+ parts

$1.110

100+ parts

-

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-

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663

$1.110

-

-

-

Corphita

USA . 259 parts In-Stock

1+ parts

$1.178

100+ parts

-

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-

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259

$1.178

-

-

-

Corohmni

South Africa . 122 parts In-Stock

1+ parts

$1.309

100+ parts

-

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-

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122

$1.309

-

-

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Parana Technologies

USA . 1,988 parts In-Stock

1+ parts

$8.431

100+ parts

-

1k+ parts

$9.072

10k+ parts

-

1,988

$8.431

-

$9.072

-

DigiPath Technology Company

USA . 1,678 parts In-Stock

1+ parts

$9.284

100+ parts

$8.541

1k+ parts

-

10k+ parts

-

1,678

$9.284

$8.541

-

-

ChromeModa Solutions

Germany . 593 parts In-Stock

1+ parts

$9.473

100+ parts

$7.768

1k+ parts

-

10k+ parts

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593

$9.473

$7.768

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IDEA Electronic Components Group

UK . 416 parts In-Stock

1+ parts

$9.473

100+ parts

$8.999

1k+ parts

$8.526

10k+ parts

-

416

$9.473

$8.999

$8.526

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QUARKTWIN TECHNOLOGY LTD

USA . 15,340 parts In-Stock

1+ parts

-

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15,340

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

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Northwest PG Solutions

USA . 2,149 parts In-Stock

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2,149

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Native Components

USA . 612 parts In-Stock

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612

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Overview

Enhance your power management system with the BQ771811DPJT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this small yet powerful device ensures optimal efficiency while maintaining a compact footprint. Experience the seamless integration of advanced technology and superior quality with the BQ771811DPJT, providing you with the best value and benefits for all your power management needs. Trust Texas Instruments to deliver excellence in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers good durability and protection for the integrated circuit within.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs.

Nominal Supply Voltage (Vsup): 18 V

The 18V nominal supply voltage provides a suitable power input for a variety of applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this IC can withstand high temperature environments for reliable performance.

Minimum Operating Temperature: -40 °C

The -40°C minimum operating temperature ensures functionality even in extreme cold conditions.

No. of Channels: 5

Having 5 channels allows the IC to support multiple power management functions concurrently, increasing versatility.

Width (mm): 3 mm

The small width of 3mm makes this IC suitable for applications with limited space constraints.

Terminal Pitch: 0.65 mm

The close terminal pitch of 0.65mm enables compact PCB design and layout efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this IC is built to withstand harsh operating conditions and maintain reliability.

Maximum Supply Current (Isup): 0.002 mA

The low maximum supply current of 0.002mA helps in conserving power and reducing energy consumption.

Technical Specifications

Power Management ICs BQ771811DPJT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.65

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

5

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.17,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

18 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.225V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ771811DPJT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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