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BQ771808DPJT

Texas Instruments

BQ771808DPJT by Texas Instruments

BQ771808DPJT by Texas Instruments is a Power Management IC with a small outline and very thin profile. It has a nominal threshold voltage of +4.2V, max supply voltage of 25V, and low supply current of 0.002 mA. Ideal for power supply support circuits in compact electronic devices.

Median Price

$1.309

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 362 parts In-Stock

1+ parts

$0.620

100+ parts

$0.610

1k+ parts

$0.600

10k+ parts

-

362

$0.620

$0.610

$0.600

-

Texas Instruments

USA . 59,749 parts In-Stock

1+ parts

$1.309

100+ parts

$1.007

1k+ parts

$0.530

10k+ parts

-

59,749

$1.309

$1.007

$0.530

-

DigiKey

USA . 879 parts In-Stock

1+ parts

$1.500

100+ parts

$0.880

1k+ parts

$0.779

10k+ parts

-

879

$1.500

$0.880

$0.779

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,072 parts In-Stock

1+ parts

$1.244

100+ parts

-

1k+ parts

-

10k+ parts

-

2,072

$1.244

-

-

-

Chip Stock

USA . 335,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

335,860

-

-

-

-

Vyrian

USA . 5,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,993

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 30,092 parts In-Stock

1+ parts

$1.110

100+ parts

-

1k+ parts

-

10k+ parts

-

30,092

$1.110

-

-

-

Corphita

USA . 399 parts In-Stock

1+ parts

$1.178

100+ parts

-

1k+ parts

-

10k+ parts

-

399

$1.178

-

-

-

Corohmni

South Africa . 68 parts In-Stock

1+ parts

$1.309

100+ parts

-

1k+ parts

-

10k+ parts

-

68

$1.309

-

-

-

Parana Technologies

USA . 2,087 parts In-Stock

1+ parts

$1.699

100+ parts

-

1k+ parts

$2.296

10k+ parts

-

2,087

$1.699

-

$2.296

-

DigiPath Technology Company

USA . 2,350 parts In-Stock

1+ parts

$1.871

100+ parts

$1.721

1k+ parts

-

10k+ parts

-

2,350

$1.871

$1.721

-

-

IDEA Electronic Components Group

UK . 2,286 parts In-Stock

1+ parts

$1.909

100+ parts

-

1k+ parts

$1.718

10k+ parts

-

2,286

$1.909

-

$1.718

-

ChromeModa Solutions

Germany . 748 parts In-Stock

1+ parts

$1.909

100+ parts

$1.565

1k+ parts

-

10k+ parts

-

748

$1.909

$1.565

-

-

Semicontronic

India . 30,063 parts In-Stock

1+ parts

$2.420

100+ parts

$2.360

1k+ parts

$2.347

10k+ parts

-

30,063

$2.420

$2.360

$2.347

-

Lixinc

USA . 15,733 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,733

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Native Components

USA . 380 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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380

-

-

-

-

Northwest PG Solutions

USA . 220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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220

-

-

-

-

Overview

Enhance the performance of your power management systems with the BQ771808DPJT by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers innovative solutions for a wide range of applications in the Power Management ICs category. This small outline, heat sink package offers customers a valuable combination of efficiency, precision, and durability. Trust Texas Instruments to provide cutting-edge technology that meets your power supply support circuit needs with ease. Elevate your designs with the BQ771808DPJT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts, ensuring easy integration into existing designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Small outline, heat sink/slug, and very thin profile design minimize space requirements, making it ideal for compact electronic devices.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.

Terminal Position: DUAL

Dual terminal position enhances flexibility in circuit configuration and provides redundancy for increased reliability.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for a slim profile and compact design, suitable for space-constrained applications.

Width (mm): 3 mm

Narrow width facilitates placement in tight spaces, enabling efficient use of board real estate.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit functionality ensures stable and accurate power delivery, essential for various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the product is designed for quick and reliable soldering processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures proper solder melting and bonding, leading to robust connections during assembly.

Length: 4 mm

Compact length simplifies PCB layout and offers flexibility in design placement options.

Nominal Threshold Voltage (V): +4.2V

Nominal threshold voltage of +4.2V provides precise power regulation, crucial for maintaining stable operation within specified voltage limits.

Maximum Supply Current (Isup): 0.002 mA

Low maximum supply current ensures minimal power consumption, contributing to energy efficiency and extended battery life in portable devices.

Terminal Form: NO LEAD

No-lead terminal form complies with RoHS regulations, promoting environmentally friendly manufacturing practices.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for precise component placement on the PCB, supporting high-density circuit designs.

Maximum Supply Voltage (Vsup): 25 V

High maximum supply voltage of 25V offers compatibility with a wide range of power sources, ensuring versatility in application scenarios.

Technical Specifications

Power Management ICs BQ771808DPJT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.65

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

25 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ771808DPJT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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