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BQ771600DPJT

Texas Instruments

BQ771600DPJT by Texas Instruments

BQ771600DPJT by Texas Instruments is a Power Management IC with 8 terminals, operating temperature range of -40 to 85 °C. It supports power supplies from 3V to 20V and has a terminal pitch of 0.65mm. Ideal for industrial applications requiring low supply current and high threshold voltage stability.

Median Price

$1.183

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55,500 parts In-Stock

1+ parts

$0.560

100+ parts

$0.550

1k+ parts

$0.540

10k+ parts

-

55,500

$0.560

$0.550

$0.540

-

Texas Instruments

USA . 59,500 parts In-Stock

1+ parts

$1.183

100+ parts

$0.910

1k+ parts

$0.479

10k+ parts

-

59,500

$1.183

$0.910

$0.479

-

DigiKey

USA . 970 parts In-Stock

1+ parts

$1.600

100+ parts

$0.941

1k+ parts

$0.833

10k+ parts

$0.793

970

$1.600

$0.941

$0.833

$0.793

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,737 parts In-Stock

1+ parts

$0.532

100+ parts

-

1k+ parts

-

10k+ parts

-

2,737

$0.532

-

-

-

Chip Stock

USA . 30,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,110

-

-

-

-

Vyrian

USA . 9,715 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,715

-

-

-

-

Classic Components Corporation

USA . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 38,192 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

-

10k+ parts

-

38,192

$0.476

-

-

-

Corphita

USA . 1,428 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

1,428

$0.504

-

-

-

Native Components

USA . 9 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$0.950

-

-

-

Northwest PG Solutions

USA . 1,660 parts In-Stock

1+ parts

$1.044

100+ parts

-

1k+ parts

-

10k+ parts

-

1,660

$1.044

-

-

-

Component Stockers USA

USA . 239 parts In-Stock

1+ parts

$1.550

100+ parts

$1.080

1k+ parts

-

10k+ parts

-

239

$1.550

$1.080

-

-

Parana Technologies

USA . 295 parts In-Stock

1+ parts

$9.833

100+ parts

-

1k+ parts

$10.401

10k+ parts

-

295

$9.833

-

$10.401

-

DigiPath Technology Company

USA . 1,427 parts In-Stock

1+ parts

$10.827

100+ parts

$9.961

1k+ parts

-

10k+ parts

-

1,427

$10.827

$9.961

-

-

ChromeModa Solutions

Germany . 6,845 parts In-Stock

1+ parts

$11.048

100+ parts

$9.059

1k+ parts

-

10k+ parts

-

6,845

$11.048

$9.059

-

-

IDEA Electronic Components Group

UK . 1,920 parts In-Stock

1+ parts

$11.048

100+ parts

$10.496

1k+ parts

$9.943

10k+ parts

-

1,920

$11.048

$10.496

$9.943

-

Lixinc

USA . 7,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,554

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Overview

Experience the power of reliable and efficient power management with the BQ771600DPJT by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and performance. Ideal for a wide range of applications, this product is a game-changer in the industry. From its durable package body material to its advanced terminal finish, every detail has been thoughtfully designed to provide exceptional value to our customers. Trust Texas Instruments for superior technology that delivers consistent results. Elevate your power management capabilities with the BQ771600DPJT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for various applications while keeping manufacturing costs low.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

Power Supplies (V): 3/20

This product can support a wide range of power supplies, making it versatile and suitable for different voltage requirements.

No. of Terminals: 8

Having 8 terminals allows for more connections and flexibility in the circuit design, enabling the product to handle various functions and interfaces.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile design make the product compact and efficient in managing power while maintaining optimal temperature levels.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and ensure reliable performance in harsh industrial settings.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for applications in cold environments or outdoor settings.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring a reliable connection in various operating conditions.

Terminal Position: DUAL

Having dual terminal positions allows for more flexibility in circuit design and installation options, accommodating different PCB layouts and configurations.

Width (mm): 3 mm

The compact width of 3mm makes this product suitable for space-constrained applications and PCB designs, saving valuable board space.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand peak reflow temperatures for up to 30 seconds, ensuring proper soldering and reliable connections during the assembly process.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, this product can endure the reflow soldering process without degradation, ensuring long-term reliability.

Length: 4 mm

The compact length of 4mm makes this product suitable for space-saving designs and applications requiring a small footprint.

Nominal Threshold Voltage (V): +4.3V

The nominal threshold voltage of +4.3V ensures stable operation and accurate power management within the specified range, enhancing the product's reliability.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this product is suitable for rugged environments and industrial applications that require high reliability and durability.

Maximum Supply Current (Isup): 0.002 mA

The low maximum supply current of 0.002 mA ensures energy-efficient operation and minimal power consumption, making the product ideal for battery-powered devices.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and complies with environmental regulations, ensuring the product's safety and sustainability.

Terminal Pitch: 0.65 mm

With a small terminal pitch of 0.65mm, this product allows for high-density connections on the PCB, saving space and enabling compact designs.

Maximum Supply Voltage (Vsup): 20 V

Being able to handle a maximum supply voltage of 20V enables this product to support various power sources and applications with higher voltage requirements.

Technical Specifications

Power Management ICs BQ771600DPJT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

Battery over-voltage protection(Min/Max)(V) : 3.85 and 4.6

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/20

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.002 mA

Maximum Supply Voltage (Vsup):

20 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.3V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

BQ771600DPJT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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