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BQ7694002DBTR

Texas Instruments

BQ7694002DBTR by Texas Instruments

BQ7694002DBTR by Texas Instruments is a Power Management IC with 44 terminals and a small outline, thin profile package. It has an operating temperature range of -40 to 85°C and supports power supply circuits. Its adjustable threshold and low supply current make it suitable for industrial applications.

Median Price

$3.368

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 21,968 parts In-Stock

1+ parts

$4.070

100+ parts

$3.318

1k+ parts

$2.212

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21,968

$4.070

$3.318

$2.212

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Arrow

USA . 4,000 parts In-Stock

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-

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$2.666

4,000

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$2.666

Distributors (In-Stock)

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Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.243

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200

$2.243

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Digiode

USA . 2,934 parts In-Stock

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$3.866

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2,934

$3.866

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Maritex

Poland . 100 parts In-Stock

1+ parts

$7.054

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$4.430

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$3.596

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100

$7.054

$4.430

$3.596

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Vyrian

USA . 8,278 parts In-Stock

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8,278

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Chip Stock

USA . 6,000 parts In-Stock

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Martec Srl

Italy . 6,000 parts In-Stock

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HZD GmbH

Germany . 800 parts In-Stock

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800

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VNN

France . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 583 parts In-Stock

1+ parts

$2.243

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583

$2.243

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Continental Prestige Electronics

USA . 6,536 parts In-Stock

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$2.243

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-

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$2.198

6,536

$2.243

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$2.198

Argo Parts USA

USA . 2,614 parts In-Stock

1+ parts

$2.243

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2,614

$2.243

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Ampacity Inc.

Singapore . 12,762 parts In-Stock

1+ parts

$2.270

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12,762

$2.270

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Corphita

USA . 613 parts In-Stock

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$3.663

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613

$3.663

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Semicontronic

India . 12,932 parts In-Stock

1+ parts

$4.930

100+ parts

$4.807

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$4.782

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12,932

$4.930

$4.807

$4.782

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Parana Technologies

USA . 1,688 parts In-Stock

1+ parts

$6.615

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$7.344

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1,688

$6.615

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$7.344

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DigiPath Technology Company

USA . 2,272 parts In-Stock

1+ parts

$7.284

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$6.702

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2,272

$7.284

$6.702

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IDEA Electronic Components Group

UK . 1,212 parts In-Stock

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$7.433

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$6.690

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1,212

$7.433

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$6.690

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ChromeModa Solutions

Germany . 731 parts In-Stock

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$7.433

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$6.095

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731

$7.433

$6.095

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AZTECH Wire

Italy . 159 parts In-Stock

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$10.120

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Component Stockers USA

USA . 13,618 parts In-Stock

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Lixinc

USA . 13,061 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Perfect Parts

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Kepictronics

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Futuretech Components

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Component Connect

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Overview

Experience the power of reliable performance with the BQ7694002DBTR by Texas Instruments. As a leader in power management ICs, Texas Instruments consistently delivers top-quality products that meet the highest industry standards. The BQ7694002DBTR is no exception, offering unparalleled value and benefits to customers. With its small outline, thin profile, and shrink pitch package style, this versatile IC is perfect for a range of applications. Whether you're looking for power supply support or need a solution for your industrial-grade project, the BQ7694002DBTR has got you covered. Say goodbye to technical headaches and hello to seamless functionality with Texas Instruments' exceptional offering.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection, making the product suitable for long-term use.

Surface Mount:

YES. This feature allows for easy installation and soldering, saving time and effort during assembly.

No. of Functions:

1. With a single function, this power management IC simplifies circuit designs and reduces complexity.

Package Shape:

RECTANGULAR. The rectangular shape improves compatibility with various devices and ensures easy integration into different applications.

No. of Terminals:

44. The large number of terminals offers versatile connectivity options, allowing for the connection of multiple external devices.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH. This compact package style enhances space efficiency, making it ideal for applications with limited board space.

Maximum Operating Temperature:

85 °C. With a high maximum operating temperature, this IC can withstand demanding environmental conditions, ensuring reliable performance.

Minimum Operating Temperature:

40 °C. The low minimum operating temperature allows for reliable operation even in extremely cold environments.

Terminal Finish:

NICKEL PALLADIUM GOLD. The terminal finish provides excellent conductivity, corrosion resistance, and reliability, ensuring a long lifespan for the product.

Terminal Position:

DUAL. Dual terminal positions increase flexibility in circuit layout and enable efficient heat dissipation, contributing to overall system performance.

Maximum Seated Height:

1.2 mm. The low seated height minimizes the overall package size, making it suitable for applications with height restrictions.

Width (mm):

4.4 mm. The compact width enables the IC to fit into narrow spaces, offering more flexibility in design and integration.

Other IC type:

POWER SUPPLY SUPPORT CIRCUIT. This IC type provides critical support for power supply systems, ensuring stable and efficient power delivery.

Minimum Supply Voltage (Vsup):

6 V. The low minimum supply voltage requirement ensures compatibility with a wide range of power sources, enhancing versatility and usability.

Maximum Time At Peak Reflow Temperature (s):

30. This IC can withstand peak reflow temperatures for an extended duration, simplifying the manufacturing process and ensuring secure solder joints.

Peak Reflow Temperature °C:

260. The high peak reflow temperature capability enables durable and robust solder connections, improving product reliability.

Length:

11 mm. The compact length facilitates easy integration into various system designs, optimizing space utilization.

Nominal Threshold Voltage (V):

+0.7V. The nominal threshold voltage ensures accurate power management and control, delivering optimal performance.

Temperature Grade:

INDUSTRIAL. Designed for industrial applications, this IC operates reliably under challenging temperature conditions, making it suitable for demanding environments.

Maximum Supply Current (Isup):

5 mA. The low maximum supply current minimizes power consumption, contributing to energy efficiency and extending battery life.

No. of Channels:

1. With a single channel, this power management IC simplifies system design by focusing on a specific function, enhancing overall performance.

Terminal Form:

GULL WING. The gull wing terminal form offers secure and reliable connections, enabling stable signal transmission and efficient power delivery.

Terminal Pitch:

0.5 mm. The small terminal pitch enhances connectivity options and facilitates fine-pitch mounting, making it suitable for high-density PCB layouts.

Moisture Sensitivity Level (MSL):

2. The MSL 2 rating ensures proper handling and storage conditions during manufacturing, guaranteeing the IC's reliability.

Maximum Supply Voltage (Vsup):

25 V. This high maximum supply voltage capability enables compatibility with a wide range of power sources, enhancing versatility and usability.

Adjustable Threshold:

YES. The adjustable threshold feature allows for customization and precise tuning of the threshold voltage according to specific application requirements.

Technical Specifications

Power Management ICs BQ7694002DBTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE= 0.7V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

11 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.7V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ7694002DBTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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