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BQ76PL455APFCT

Texas Instruments

BQ76PL455APFCT by Texas Instruments

BQ76PL455APFCT by Texas Instruments is a Power Management IC with 16 channels and a nominal voltage of 57.6V. It features a flatpack, thin profile package style suitable for power supply support circuits. With an operating temperature range from -40 to 85°C, it is ideal for industrial applications requiring precise power management.

Median Price

$21.445

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 233 parts In-Stock

1+ parts

$21.440

100+ parts

$16.670

1k+ parts

$15.080

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233

$21.440

$16.670

$15.080

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DigiKey

USA . 221 parts In-Stock

1+ parts

$21.450

100+ parts

$16.890

1k+ parts

$15.085

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221

$21.450

$16.890

$15.085

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Distributors (In-Stock)

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Maritex

Poland . 500 parts In-Stock

1+ parts

$15.980

100+ parts

$10.797

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500

$15.980

$10.797

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Nova Conductors

Japan . 300 parts In-Stock

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$16.576

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300

$16.576

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Digiode

USA . 2,965 parts In-Stock

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$20.368

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$20.368

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Vyrian

USA . 2,330 parts In-Stock

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VNN

France . 867 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,187 parts In-Stock

1+ parts

$3.574

100+ parts

$331.922

1k+ parts

$3.217

10k+ parts

-

1,187

$3.574

$331.922

$3.217

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DigiPath Technology Company

USA . 1,766 parts In-Stock

1+ parts

$3.936

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-

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1,766

$3.936

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ChromeModa Solutions

Germany . 2,556 parts In-Stock

1+ parts

$4.016

100+ parts

$3.293

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2,556

$4.016

$3.293

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IDEA Electronic Components Group

UK . 620 parts In-Stock

1+ parts

$4.016

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-

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$3.614

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620

$4.016

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$3.614

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Continental Prestige Electronics

USA . 5,557 parts In-Stock

1+ parts

$16.576

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$16.245

5,557

$16.576

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$16.245

Ampacity Inc.

Singapore . 227 parts In-Stock

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$18.220

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$18.220

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AZTECH Wire

Italy . 859 parts In-Stock

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$18.848

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Corphita

USA . 3,968 parts In-Stock

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$19.296

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Corohmni

South Africa . 1,225 parts In-Stock

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$20.762

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$20.762

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Semicontronic

India . 227 parts In-Stock

1+ parts

$39.660

100+ parts

$38.668

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$38.470

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227

$39.660

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$38.470

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Lixinc

USA . 14,043 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,476 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$16.245

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$15.748

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$15.416

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$16.245

$15.748

$15.416

Microchip USA

USA . 204 parts In-Stock

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Kepictronics

USA . 130 parts In-Stock

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Overview

Unlock the power of efficient power management with the BQ76PL455APFCT by Texas Instruments. Crafted with precision and quality, this Power Management IC offers unparalleled performance in a variety of applications. With its innovative design and advanced features, customers can expect seamless integration, enhanced reliability, and optimized functionality. Trust Texas Instruments to deliver excellence in every product, and experience the difference with the BQ76PL455APFCT. Elevate your projects with superior technology and unmatched value today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications while providing protection to the internal components.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Package Shape: SQUARE

The square package shape helps in optimizing PCB layout and space utilization, making it convenient for compact designs.

Nominal Supply Voltage (Vsup): 57.6 V

This voltage level provides a stable power supply to the connected devices, ensuring consistent performance.

No. of Terminals: 80

Having a higher number of terminals allows for more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance under extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides corrosion resistance and reliable electrical connections, contributing to the overall longevity of the product.

Terminal Position: QUAD

The quad terminal position offers stability and ease of soldering, enhancing the overall quality of the connection.

Maximum Seated Height: 1.2 mm

The low seated height helps in space-constrained designs and allows for a more compact form factor.

Width (mm): 12 mm

The 12mm width provides a balance between space efficiency and accessibility for handling and installation.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product can efficiently manage and distribute power to various components, enhancing system performance.

Minimum Supply Voltage (Vsup): 12 V

The low minimum supply voltage allows for compatibility with a wide range of devices and power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The extended time at peak reflow temperature ensures proper soldering and connection integrity during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability ensures reliable soldering and durability under harsh reflow conditions.

Length: 12 mm

The 12mm length complements the width and seated height, resulting in a well-balanced and space-efficient form factor.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Maximum Supply Current (Isup): 7 mA

The low supply current consumption helps in energy efficiency and ensures minimal power loss during operation.

No. of Channels: 16

Having 16 channels allows for managing multiple power supplies and loads effectively, enhancing system versatility.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical strength and easy soldering, ensuring robust electrical connections.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting and precise connectivity, suitable for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the product's resistance to moisture absorption, enhancing reliability in humid environments.

Maximum Supply Voltage (Vsup): 79.2 V

The high maximum supply voltage capability provides flexibility in powering a wide range of devices and components.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization and fine-tuning of voltage levels, catering to specific application requirements.

Technical Specifications

Power Management ICs BQ76PL455APFCT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

7 mA

Maximum Supply Voltage (Vsup):

79.2 V

Minimum Supply Voltage (Vsup):

12 V

Nominal Supply Voltage (Vsup):

57.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

BQ76PL455APFCT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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