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BQ7693001DBT

Texas Instruments

BQ7693001DBT by Texas Instruments

BQ7693001DBT by Texas Instruments is a Power Management IC with 30 terminals, operating temperature range of -40 to 85°C. It supports power supply circuits, has a min supply voltage of 6V, and adjustable threshold voltage of +0.7V. Ideal for industrial applications requiring precise power management in compact spaces.

Median Price

$5.426

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 972 parts In-Stock

1+ parts

$2.590

100+ parts

$2.540

1k+ parts

$2.490

10k+ parts

-

972

$2.590

$2.540

$2.490

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Farnell

UK . 16 parts In-Stock

1+ parts

$4.830

100+ parts

$4.570

1k+ parts

$4.510

10k+ parts

-

16

$4.830

$4.570

$4.510

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Texas Instruments

USA . 290,365 parts In-Stock

1+ parts

$4.961

100+ parts

$4.347

1k+ parts

$2.456

10k+ parts

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290,365

$4.961

$4.347

$2.456

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DigiKey

USA . 220 parts In-Stock

1+ parts

$5.890

100+ parts

$3.913

1k+ parts

$3.491

10k+ parts

$3.317

220

$5.890

$3.913

$3.491

$3.317

Mouser Electronics

USA . 168 parts In-Stock

1+ parts

$5.890

100+ parts

$3.920

1k+ parts

$3.490

10k+ parts

$3.400

168

$5.890

$3.920

$3.490

$3.400

Element14

Singapore . 16 parts In-Stock

1+ parts

$8.320

100+ parts

-

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16

$8.320

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Distributors (In-Stock)

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Digiode

USA . 577 parts In-Stock

1+ parts

$2.460

100+ parts

-

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-

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577

$2.460

-

-

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$3.644

100+ parts

-

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15

$3.644

-

-

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Chip Stock

USA . 15,633 parts In-Stock

1+ parts

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15,633

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Vyrian

USA . 5,437 parts In-Stock

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5,437

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VNN

France . 1,302 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 300 parts In-Stock

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300

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Distributors (Availability)

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Parana Technologies

USA . 2,228 parts In-Stock

1+ parts

$1.025

100+ parts

-

1k+ parts

$1.895

10k+ parts

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2,228

$1.025

-

$1.895

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DigiPath Technology Company

USA . 794 parts In-Stock

1+ parts

$1.129

100+ parts

-

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794

$1.129

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ChromeModa Solutions

Germany . 4,760 parts In-Stock

1+ parts

$1.152

100+ parts

$0.945

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-

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4,760

$1.152

$0.945

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IDEA Electronic Components Group

UK . 1,086 parts In-Stock

1+ parts

$1.152

100+ parts

-

1k+ parts

$1.037

10k+ parts

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1,086

$1.152

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$1.037

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Semicontronic

India . 48,587 parts In-Stock

1+ parts

$2.200

100+ parts

$2.145

1k+ parts

$2.134

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48,587

$2.200

$2.145

$2.134

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Ampacity Inc.

Singapore . 48,359 parts In-Stock

1+ parts

$2.200

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48,359

$2.200

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Corphita

USA . 4,871 parts In-Stock

1+ parts

$2.331

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4,871

$2.331

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$3.571

100+ parts

-

1k+ parts

$3.428

10k+ parts

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100

$3.571

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$3.428

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Argo Parts USA

USA . 862 parts In-Stock

1+ parts

$3.644

100+ parts

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862

$3.644

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Continental Prestige Electronics

USA . 22 parts In-Stock

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$4.510

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22

$4.510

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Corohmni

South Africa . 412 parts In-Stock

1+ parts

$16.995

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412

$16.995

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Lixinc

USA . 19,823 parts In-Stock

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19,823

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the power of efficient energy management with the BQ7693001DBT from Texas Instruments. As a leader in Power Management ICs, Texas Instruments brings you a high-quality product that is versatile and reliable. This small outline, thin profile IC offers a wide range of applications and benefits, from power supply support circuits to industrial-grade temperature requirements. With features like adjustable threshold voltage and low supply current, this IC provides value and efficiency for your electronic projects. Choose Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic package body material is lightweight, durable, and cost-effective, making the product ideal for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and reducing production costs.

Package Shape: RECTANGULAR

Rectangular package shape ensures compatibility with standard board layouts and facilitates efficient placement and routing of components.

No. of Terminals: 30

With 30 terminals, this product offers a high level of connectivity options for interfacing with other components and peripherals in a system.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance even in demanding environmental conditions, ensuring product longevity.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operational stability in both extreme cold and hot environments, making the product versatile and reliable.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the product's overall performance and reliability.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact design and space-saving installation, making the product suitable for applications with limited board space.

Width (mm): 4.4 mm

Narrow width helps in efficient board layout and space optimization, allowing for compact system designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuit functionality enhances the product's capability to manage and regulate power efficiently, ensuring stable performance of connected devices.

Minimum Supply Voltage (Vsup): 6 V

Low minimum supply voltage requirement enables the product to operate with a wide range of power sources, increasing its versatility and compatibility.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for reliable soldering during assembly, ensuring proper connections and overall product quality.

Length: 7.8 mm

Compact length contributes to space-saving designs and easy integration into various devices and systems.

Nominal Threshold Voltage (V): +0.7V

Precise nominal threshold voltage ensures accurate voltage regulation and protection, enhancing the product's performance and reliability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating indicates the product's suitability for use in harsh industrial environments, ensuring ruggedness and durability.

Maximum Supply Current (Isup): 5 mA

Low maximum supply current requirement helps in reducing power consumption and heat generation, improving the product's efficiency and reliability.

Terminal Form: GULL WING

Gull wing terminal form provides secure mechanical and electrical connections, facilitating easy assembly and ensuring reliability in operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and space-efficient PCB layout, enabling the product to be used in compact electronic devices.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the product's ability to withstand moderate humidity conditions during storage and assembly, ensuring long-term reliability.

Maximum Supply Voltage (Vsup): 25 V

High maximum supply voltage tolerance provides flexibility in power source selection and compatibility with a wide range of applications and systems.

Adjustable Threshold: YES

Adjustable threshold feature allows for customization and fine-tuning of voltage regulation parameters, making the product adaptable to varying requirements.

Technical Specifications

Power Management ICs BQ7693001DBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE= 0.7V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.7V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

BQ7693001DBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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