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BQ51051BYFPT

Texas Instruments

BQ51051BYFPT by Texas Instruments

BQ51051BYFPT by Texas Instruments is a Power Management IC with 28 terminals in a rectangular grid array package. It operates b/w 0-125°C, supporting power supplies of 4/10V and drawing a max current of 10mA. Ideal for applications requiring thin profile and fine pitch components.

Median Price

$3.588

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 115 parts In-Stock

1+ parts

$0.440

100+ parts

$0.419

1k+ parts

-

10k+ parts

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115

$0.440

$0.419

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Texas Instruments

USA . 750 parts In-Stock

1+ parts

$3.588

100+ parts

$3.144

1k+ parts

$1.776

10k+ parts

-

750

$3.588

$3.144

$1.776

-

DigiKey

USA . 531 parts In-Stock

1+ parts

$4.930

100+ parts

$3.719

1k+ parts

$3.318

10k+ parts

$3.110

531

$4.930

$3.719

$3.318

$3.110

Mouser Electronics

USA . 162 parts In-Stock

1+ parts

$4.930

100+ parts

$3.720

1k+ parts

$2.940

10k+ parts

$2.860

162

$4.930

$3.720

$2.940

$2.860

Verical

USA . 115 parts In-Stock

1+ parts

-

100+ parts

$0.419

1k+ parts

-

10k+ parts

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115

-

$0.419

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,619 parts In-Stock

1+ parts

$0.418

100+ parts

-

1k+ parts

-

10k+ parts

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1,619

$0.418

-

-

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Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$2.089

100+ parts

-

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27

$2.089

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-

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Vyrian

USA . 5,088 parts In-Stock

1+ parts

-

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5,088

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Bristol Electronics

USA . 2,393 parts In-Stock

1+ parts

-

100+ parts

$2.083

1k+ parts

$1.829

10k+ parts

-

2,393

-

$2.083

$1.829

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Dan-Mar Components

USA . 2,393 parts In-Stock

1+ parts

-

100+ parts

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2,393

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ACDS - Activité Composants Distribution Service

France . 2,250 parts In-Stock

1+ parts

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2,250

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VNN

France . 2,177 parts In-Stock

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2,177

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 348 parts In-Stock

1+ parts

$0.356

100+ parts

$0.347

1k+ parts

$0.345

10k+ parts

-

348

$0.356

$0.347

$0.345

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Ampacity Inc.

Singapore . 157 parts In-Stock

1+ parts

$0.356

100+ parts

-

1k+ parts

-

10k+ parts

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157

$0.356

-

-

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Corphita

USA . 4,304 parts In-Stock

1+ parts

$0.396

100+ parts

-

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4,304

$0.396

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.047

100+ parts

-

1k+ parts

$1.965

10k+ parts

-

1,000

$2.047

-

$1.965

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Continental Prestige Electronics

USA . 6,040 parts In-Stock

1+ parts

$2.089

100+ parts

-

1k+ parts

-

10k+ parts

$2.047

6,040

$2.089

-

-

$2.047

Argo Parts USA

USA . 1,208 parts In-Stock

1+ parts

$2.089

100+ parts

-

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1,208

$2.089

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Corohmni

South Africa . 84 parts In-Stock

1+ parts

$8.809

100+ parts

-

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84

$8.809

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Parana Technologies

USA . 539 parts In-Stock

1+ parts

$13.714

100+ parts

-

1k+ parts

$14.206

10k+ parts

-

539

$13.714

-

$14.206

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DigiPath Technology Company

USA . 187 parts In-Stock

1+ parts

$15.101

100+ parts

-

1k+ parts

-

10k+ parts

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187

$15.101

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ChromeModa Solutions

Germany . 2,866 parts In-Stock

1+ parts

$15.409

100+ parts

$12.635

1k+ parts

-

10k+ parts

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2,866

$15.409

$12.635

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IDEA Electronic Components Group

UK . 1,131 parts In-Stock

1+ parts

$15.409

100+ parts

$14.639

1k+ parts

$13.868

10k+ parts

-

1,131

$15.409

$14.639

$13.868

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Lixinc

USA . 10,064 parts In-Stock

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10,064

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A-Z Elektronik GmbH

Germany . 6,152 parts In-Stock

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6,152

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Alle Elektronik GmbH

Germany . 4,101 parts In-Stock

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4,101

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Kepictronics

USA . 196 parts In-Stock

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196

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Overview

Elevate your power management capabilities with the BQ51051BYFPT from Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers cutting-edge Power Management ICs that set the standard in the industry. This versatile component is perfect for a wide range of applications, offering customers unmatched value, benefits, and advantages. Whether you're looking to enhance efficiency, reliability, or performance, the BQ51051BYFPT is the perfect solution for all your power management needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making this product ideal for mass production and cost-effective manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space, making it suitable for compact designs and high-density applications.

Power Supplies (V): 4/10

Support for a wide range of power supply voltages (4V to 10V) makes this product versatile and applicable in a variety of electronic devices and systems.

No. of Terminals: 28

Having a higher number of terminals allows for more connections and features, giving designers flexibility and options for customizing power management solutions.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enhances thermal performance, reduces board space usage, and enables high-speed signal routing, making it suitable for high-performance applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions and ensure reliable operation under extreme temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows for operation in cold environments without compromising performance, making it suitable for a wide range of applications.

Maximum Seated Height: 0.5 mm

The low maximum seated height of 0.5mm enables compact and slim designs, reducing the overall size of the PCB and facilitating space-saving integration in small electronic devices.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent solderability, corrosion resistance, and electrical conductivity, ensuring reliable and long-lasting connections in power management circuits.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly processes without causing damage to the components, resulting in high manufacturing yield and product quality.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering and rework processes, ensuring robust and reliable connections in power management circuits.

Nominal Threshold Voltage (V): +15V

The nominal threshold voltage of +15V provides a reference point for voltage regulation and protection, allowing designers to set appropriate thresholds for safe and efficient power management.

Maximum Supply Current (Isup): 10 mA

With a maximum supply current of 10 mA, this product is suitable for low-power applications, providing efficient power management and ensuring minimal energy consumption.

Terminal Form: BALL

The ball terminal form offers reliable and robust connections, minimizing contact resistance and ensuring stable power delivery in power management circuits.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm enables high-density mounting and miniaturization of power management circuits, making it suitable for compact and slim electronic devices.

Technical Specifications

Power Management ICs BQ51051BYFPT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B28

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA28,4X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4/10

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+15V

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ51051BYFPT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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