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BQ51051BRHLT

Texas Instruments

BQ51051BRHLT by Texas Instruments

BQ51051BRHLT by Texas Instruments is a Power Management IC with 20 terminals, operating voltage of 4-10V, and terminal finish in Nickel Palladium Gold. It is used for power supply support circuits in applications requiring a max temperature of 125°C.

Median Price

$3.360

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 500 parts In-Stock

1+ parts

$3.588

100+ parts

$3.144

1k+ parts

$1.776

10k+ parts

-

500

$3.588

$3.144

$1.776

-

Mouser Electronics

USA . 64 parts In-Stock

1+ parts

$4.930

100+ parts

$3.720

1k+ parts

$2.980

10k+ parts

$2.890

64

$4.930

$3.720

$2.980

$2.890

Rochester

USA . 13,534 parts In-Stock

1+ parts

-

100+ parts

$2.560

1k+ parts

$2.290

10k+ parts

$2.150

13,534

-

$2.560

$2.290

$2.150

DigiKey

USA . 13,534 parts In-Stock

1+ parts

-

100+ parts

$3.360

1k+ parts

-

10k+ parts

-

13,534

-

$3.360

-

-

Verical

USA . 9,168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.862

10k+ parts

-

9,168

-

-

$2.862

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,557 parts In-Stock

1+ parts

$2.346

100+ parts

-

1k+ parts

-

10k+ parts

-

3,557

$2.346

-

-

-

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$2.552

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$2.552

-

-

-

Vyrian

USA . 5,708 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,708

-

-

-

-

VNN

France . 1,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

1,244

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,198 parts In-Stock

1+ parts

$2.100

100+ parts

$2.048

1k+ parts

$2.037

10k+ parts

-

7,198

$2.100

$2.048

$2.037

-

Ampacity Inc.

Singapore . 5,589 parts In-Stock

1+ parts

$2.100

100+ parts

-

1k+ parts

-

10k+ parts

-

5,589

$2.100

-

-

-

Corphita

USA . 4,046 parts In-Stock

1+ parts

$2.223

100+ parts

-

1k+ parts

-

10k+ parts

-

4,046

$2.223

-

-

-

Argo Parts USA

USA . 4,719 parts In-Stock

1+ parts

$2.552

100+ parts

-

1k+ parts

-

10k+ parts

-

4,719

$2.552

-

-

-

Continental Prestige Electronics

USA . 591 parts In-Stock

1+ parts

$2.552

100+ parts

-

1k+ parts

-

10k+ parts

$2.501

591

$2.552

-

-

$2.501

Parana Technologies

USA . 1,591 parts In-Stock

1+ parts

$10.689

100+ parts

-

1k+ parts

$11.177

10k+ parts

-

1,591

$10.689

-

$11.177

-

DigiPath Technology Company

USA . 1,196 parts In-Stock

1+ parts

$11.770

100+ parts

$10.828

1k+ parts

-

10k+ parts

-

1,196

$11.770

$10.828

-

-

Corohmni

South Africa . 1,174 parts In-Stock

1+ parts

$11.814

100+ parts

-

1k+ parts

-

10k+ parts

-

1,174

$11.814

-

-

-

ChromeModa Solutions

Germany . 1,955 parts In-Stock

1+ parts

$12.010

100+ parts

$9.848

1k+ parts

-

10k+ parts

-

1,955

$12.010

$9.848

-

-

IDEA Electronic Components Group

UK . 976 parts In-Stock

1+ parts

$12.010

100+ parts

$11.410

1k+ parts

$10.809

10k+ parts

-

976

$12.010

$11.410

$10.809

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Lixinc

USA . 10,284 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,284

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.501

1k+ parts

$2.424

10k+ parts

$2.373

1,000

-

$2.501

$2.424

$2.373

Overview

Elevate your power management solutions with the Texas Instruments BQ51051BRHLT. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for a wide range of applications, this product boasts innovative features that deliver exceptional performance. Experience the value of seamless power supply support circuitry, compact design, and efficient terminal finish for optimal functionality. Trust Texas Instruments to provide you with cutting-edge technology that meets your power management needs effortlessly. Elevate your projects with the BQ51051BRHLT today.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

Plastic and epoxy material ensures durability and resistance to external elements, making this product reliable for long-term use.

Surface Mount YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape RECTANGULAR

Rectangular shape enables compact and space-saving design, making it suitable for applications where size constraints are a concern.

Power Supplies (V) 4/10

Supports a wide range of power supply voltages, making it versatile and compatible with various electronic devices.

No. of Terminals 20

Multiple terminals provide connectivity options for various components, enhancing the flexibility and functionality of the product.

Package Style (Meter) CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package style with chip carrier, heat sink/slug, and very thin profile design enhances thermal performance and overall efficiency of the product.

Maximum Operating Temperature 125 °C

High maximum operating temperature ensures stability and reliability even under demanding environmental conditions.

Minimum Operating Temperature 0 °C

Low minimum operating temperature allows for consistent performance in a wide range of operating environments, from cold to hot conditions.

Terminal Finish NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections over time.

Terminal Position QUAD

Quad terminal position facilitates easy installation and connection to external components, improving overall ease of use.

Maximum Seated Height 1 mm

Low maximum seated height allows for streamlined and compact device designs, enabling space-efficient installations.

Width (mm) 3.5 mm

Narrow width dimension enhances compatibility with various board layouts and configurations, making it easier to integrate into different electronic systems.

Other IC type POWER SUPPLY SUPPORT CIRCUIT

Power supply support circuitry enhances the stability and efficiency of power management, ensuring consistent and reliable performance for connected devices.

Maximum Time At Peak Reflow Temperature (s) 30

Extended time at peak reflow temperature allows for thorough soldering and secure mounting during assembly, improving overall product reliability.

Peak Reflow Temperature °C 260

High peak reflow temperature ensures strong and durable solder connections, reducing the risk of component failure or detachment over time.

Length 4.5 mm

Compact length dimension enables efficient placement and integration within tight spaces, ideal for applications with limited physical footprint.

Nominal Threshold Voltage (V) +15V

Nominal threshold voltage of +15V provides stable and consistent power regulation, ensuring proper operation and protection for connected devices.

Maximum Supply Current (Isup) 10 mA

Low maximum supply current requirement helps conserve energy and reduce power consumption, making it ideal for energy-efficient applications.

Terminal Form NO LEAD

No-lead terminal form simplifies the connection process and reduces the risk of lead-related issues, ensuring a safer and more reliable product.

Terminal Pitch 0.5 mm

Small terminal pitch of 0.5mm allows for close spacing between terminals, enabling high-density packaging and compact circuit designs.

Moisture Sensitivity Level (MSL) 2

Moisture sensitivity level of 2 indicates moderate sensitivity to moisture exposure, requiring standard handling and storage precautions to maintain product integrity.

Technical Specifications

Power Management ICs BQ51051BRHLT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20/24,.14X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4/10

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

10 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+15V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ51051BRHLT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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