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BQ4845S-A4G4

Texas Instruments

BQ4845S-A4G4 by Texas Instruments

BQ4845S-A4G4 by Texas Instruments is a CMOS timer & real-time clock IC with 28 terminals. It operates b/w 0-70°C, with supply voltage of 4.75-5.5V and clock frequency up to 0.032 MHz. Ideal for applications requiring interrupt capability and parallel, direct address access method in small outline packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,219 parts In-Stock

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Digiode

USA . 2,711 parts In-Stock

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One Stop Electronics

USA . 1,097 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 402 parts In-Stock

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$6.791

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402

$6.791

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Parana Technologies

USA . 1,634 parts In-Stock

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$34.573

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$35.517

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$32.320

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$29.124

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$35.517

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DigiPath Technology Company

USA . 340 parts In-Stock

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$38.069

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$35.024

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340

$38.069

$35.024

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ChromeModa Solutions

Germany . 3,663 parts In-Stock

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$38.846

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$31.854

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$38.846

$31.854

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IDEA Electronic Components Group

UK . 193 parts In-Stock

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$38.846

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$36.904

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$34.961

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193

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$34.961

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Corohmni

South Africa . 53 parts In-Stock

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$63.611

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QUARKTWIN TECHNOLOGY LTD

USA . 12,878 parts In-Stock

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Corphita

USA . 2,929 parts In-Stock

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Northwest PG Solutions

USA . 849 parts In-Stock

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Native Components

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Microchip USA

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Overview

Enhance your products with the BQ4845S-A4G4 by Texas Instruments, a high-quality Timers & Real-Time Clocks component that offers unparalleled precision and reliability. Manufactured by a trusted industry leader, this device provides seamless parallel, direct address access and interrupt capability for optimal performance. With its small outline package style and durable plastic/epoxy body material, this product is perfect for a wide range of applications. Trust in Texas Instruments to deliver cutting-edge technology that maximizes the value and benefits for your projects. Upgrade your systems with the BQ4845S-A4G4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Information Access Method: PARALLEL, DIRECT ADDRESS

Allows for efficient and direct access to the information stored in the device, enabling quick retrieval of data.

Power Supplies (V): 5

A common voltage supply that makes it easy to integrate this product into existing systems without the need for additional power adjustments.

Interrupt Capability: Y

The interrupt capability allows the device to notify the system of important events or alarms in real-time, enhancing the overall functionality of the product.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand a wide range of environmental conditions, making it suitable for various industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient and reliable choice for timers and real-time clocks.

Technical Specifications

Timers & Real-Time Clocks BQ4845S-A4G4 attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9705 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.667 mm

Sub-Category:

Timer or RTC

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

NO

Width:

7.5565 mm

Peripheral IC Type:

Trade Compliance

BQ4845S-A4G4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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