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BQ4802MT

Texas Instruments

BQ4802MT by Texas Instruments

BQ4802MT by Texas Instruments is a TIMER & REAL TIME CLOCK with 28 terminals, operating at 0-70°C. It uses PARALLEL, DIRECT ADDRESS access method and has an 8-bit external data bus width. Ideal for applications requiring precise timekeeping in commercial-grade devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,470 parts In-Stock

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2,470

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Digiode

USA . 1,327 parts In-Stock

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1,327

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Distributors (Availability)

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AZTECH Wire

Italy . 620 parts In-Stock

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$14.257

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620

$14.257

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Corohmni

South Africa . 229 parts In-Stock

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$15.829

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$15.829

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One Stop Electronics

USA . 990 parts In-Stock

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$28.000

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990

$28.000

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Parana Technologies

USA . 1,519 parts In-Stock

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$47.546

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$4,415.411

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$42.792

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1,519

$47.546

$4,415.411

$42.792

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DigiPath Technology Company

USA . 2,009 parts In-Stock

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$52.355

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$48.166

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2,009

$52.355

$48.166

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ChromeModa Solutions

Germany . 4,662 parts In-Stock

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$53.423

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$43.807

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4,662

$53.423

$43.807

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IDEA Electronic Components Group

UK . 1,822 parts In-Stock

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$53.423

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$50.752

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$48.081

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1,822

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$50.752

$48.081

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Corphita

USA . 4,039 parts In-Stock

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4,039

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Northwest PG Solutions

USA . 1,243 parts In-Stock

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Native Components

USA . 526 parts In-Stock

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Overview

Elevate your projects with the BQ4802MT by Texas Instruments - a top-of-the-line Timer & Real-Time Clock that delivers unparalleled precision and reliability. Manufactured by industry leader Texas Instruments, this product ensures superior quality and performance for a wide range of applications. Stay ahead of the competition with its advanced features and seamless operation. Experience the value and benefits of this high-tech solution that guarantees accuracy and efficiency every time.

Feature Benefit Bullets

Information Access Method: PARALLEL, DIRECT ADDRESS

Allows for efficient and direct communication with the timer and real-time clock, making it easy to access and control the device.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic systems and designs.

No. of Terminals: 28

Provides multiple connection points for interfacing with other components, increasing flexibility in system design.

Maximum Operating Temperature: 70 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Allows for use in a wide range of temperature conditions, making it versatile for different applications.

External Data Bus Width: 8

Wide data bus width allows for fast and efficient data transfer, improving the overall performance of the device.

Peripheral IC Type: TIMER, REAL TIME CLOCK

Combining timer and real-time clock functionalities in one device offers convenience and saves space in the system design.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the device energy-efficient and reliable.

Nominal Supply Voltage: 3.3 V

Operates at a common supply voltage, making it compatible with a wide range of electronic systems.

Technical Specifications

Timers & Real-Time Clocks BQ4802MT attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

JESD-30 Code:

R-XDMA-T28

No. of Terminals:

28

No. of Timers:

0

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

BQ4802MT Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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