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BQ4802YDWRG4

Texas Instruments

BQ4802YDWRG4 by Texas Instruments

BQ4802YDWRG4 by Texas Instruments is a CMOS timer & real-time clock IC with 28 terminals. It operates b/w 0-70°C, with interrupt capability and parallel access method. Suitable for applications requiring precise timekeeping in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,326 parts In-Stock

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Digiode

USA . 3,356 parts In-Stock

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VNN

France . 2,770 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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700

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Distributors (Availability)

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AZTECH Wire

Italy . 483 parts In-Stock

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$6.682

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483

$6.682

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Ampacity Inc.

Singapore . 1,519 parts In-Stock

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$9.000

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Advanced Electronics

New Zealand . 45 parts In-Stock

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$20.672

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$18.812

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$16.951

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45

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$16.951

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One Stop Electronics

USA . 892 parts In-Stock

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$26.000

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Parana Technologies

USA . 633 parts In-Stock

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$37.602

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$3,491.880

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$33.841

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633

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DigiPath Technology Company

USA . 854 parts In-Stock

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$41.404

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854

$41.404

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ChromeModa Solutions

Germany . 6,512 parts In-Stock

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$42.249

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$34.644

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IDEA Electronic Components Group

UK . 2,303 parts In-Stock

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$42.249

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$40.137

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$38.024

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Corohmni

South Africa . 642 parts In-Stock

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$54.517

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Continental Prestige Electronics

USA . 6,808 parts In-Stock

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Argo Parts USA

USA . 1,753 parts In-Stock

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Microchip USA

USA . 1,594 parts In-Stock

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Corphita

USA . 1,493 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Kepictronics

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Overview

Enhance your electronic devices with the BQ4802YDWRG4 from Texas Instruments, a leading manufacturer in the industry. This high-quality timer and real-time clock offers unparalleled reliability and precision for a wide range of applications. With its advanced technology and user-friendly features, this product provides customers with unmatched value and convenience. Upgrade your systems today with the BQ4802YDWRG4 to experience the benefits of superior performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto a PCB, saving space and simplifying the assembly process.

Interrupt Capability: Y

The interrupt capability allows the device to respond to external events promptly, enhancing its functionality and versatility.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and stability even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

Technical Specifications

Timers & Real-Time Clocks BQ4802YDWRG4 attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Timer or RTC

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

NO

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

BQ4802YDWRG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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