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BQ4802LYPWG4

Texas Instruments

BQ4802LYPWG4 by Texas Instruments

BQ4802LYPWG4 by Texas Instruments is a CMOS TIMER & REAL TIME CLOCK with 28 terminals, operating at 3.6V max supply voltage and 0.032 MHz clock frequency. It is used in applications requiring parallel access method, interrupt capability, and temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,267 parts In-Stock

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Digiode

USA . 2,218 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 462 parts In-Stock

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$5.441

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$5.441

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One Stop Electronics

USA . 513 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 667 parts In-Stock

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$8.884

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Corohmni

South Africa . 877 parts In-Stock

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$33.434

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Parana Technologies

USA . 607 parts In-Stock

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$58.236

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DigiPath Technology Company

USA . 1,595 parts In-Stock

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$64.125

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ChromeModa Solutions

Germany . 2,557 parts In-Stock

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$65.434

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$53.656

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IDEA Electronic Components Group

UK . 1,557 parts In-Stock

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$65.434

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$62.162

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$58.891

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Component Stockers USA

USA . 584 parts In-Stock

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$99.990

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Microchip USA

USA . 4,561 parts In-Stock

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Corphita

USA . 4,185 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,593 parts In-Stock

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Northwest PG Solutions

USA . 1,192 parts In-Stock

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$5.332

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$5.332

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Overview

Elevate your timekeeping solutions with the BQ4802LYPWG4 by Texas Instruments, a top-tier manufacturer known for high-quality Timers & Real-Time Clocks. This versatile product, featuring a compact rectangular package and parallel, direct address access method, offers unparalleled reliability and accuracy for a wide range of applications. From smart home devices to industrial automation systems, this timer and clock combo provides seamless integration and precise timing control. Experience the value and benefits of superior performance with the BQ4802LYPWG4, setting new standards in time management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Information Access Method: PARALLEL, DIRECT ADDRESS

Allows for efficient and quick access to information within the timers and real-time clocks.

Surface Mount: YES

Ease of installation and space-saving design for integration into various devices.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for different applications.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for reliable performance in various environments.

Technology: CMOS

CMOS technology ensures low power consumption and high performance in timer and clock operations.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for accurate timekeeping and timing functions.

Technical Specifications

Timers & Real-Time Clocks BQ4802LYPWG4 attributes and parameters. Explore more Timers & Real-Time Clocks devices from Texas Instruments

Specs

Maximum Clock Frequency:

.032 MHz

External Data Bus Width:

8

Information Access Method:

PARALLEL, DIRECT ADDRESS

Interrupt Capability:

Y

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

28

No. of Timers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Timer or RTC

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Minimum Time:

SECONDS

Maximum Time At Peak Reflow Temperature (s):

30

Volatile:

NO

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

BQ4802LYPWG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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