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BQ294572DRVT

Texas Instruments

BQ294572DRVT by Texas Instruments

BQ294572DRVT by Texas Instruments is a Power Management IC with 6 terminals, operating b/w -40 to 110°C. It supports supply voltages from 3V to 25V and has a small outline package style. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,464 parts In-Stock

1+ parts

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5,464

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Digiode

USA . 1,713 parts In-Stock

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1,713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 415 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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-

415

$0.500

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-

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Semicontronic

India . 747 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

747

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 591 parts In-Stock

1+ parts

$7.500

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-

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591

$7.500

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Parana Technologies

USA . 310 parts In-Stock

1+ parts

$13.862

100+ parts

-

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$14.340

10k+ parts

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310

$13.862

-

$14.340

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AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$15.176

100+ parts

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845

$15.176

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DigiPath Technology Company

USA . 1,080 parts In-Stock

1+ parts

$15.264

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1,080

$15.264

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IDEA Electronic Components Group

UK . 1,574 parts In-Stock

1+ parts

$15.575

100+ parts

$14.796

1k+ parts

$14.018

10k+ parts

-

1,574

$15.575

$14.796

$14.018

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ChromeModa Solutions

Germany . 1,102 parts In-Stock

1+ parts

$15.575

100+ parts

$12.772

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1,102

$15.575

$12.772

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Native Components

USA . 321 parts In-Stock

1+ parts

$19.025

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321

$19.025

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Northwest PG Solutions

USA . 1,896 parts In-Stock

1+ parts

$20.928

100+ parts

$18.835

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1,896

$20.928

$18.835

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Corphita

USA . 3,413 parts In-Stock

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3,413

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Corohmni

South Africa . 292 parts In-Stock

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292

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Overview

Experience superior power management with the Texas Instruments BQ294572DRVT. As a trusted manufacturer, Texas Instruments delivers top-notch quality in their Power Management ICs. This small outline, heat sink design offers a very thin profile, making it ideal for industrial applications. With a wide operating temperature range and dual terminal position, this IC provides reliability and flexibility in various settings. Trust Texas Instruments to provide cutting-edge technology that meets your power supply support circuit needs. Choose the BQ294572DRVT for unmatched performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the Power Management IC.

Surface Mount: YES

Being surface mountable, this Power Management IC is easy to install on a circuit board, making it efficient for manufacturing processes.

Nominal Supply Voltage (Vsup): 10.8 V

With a nominal supply voltage of 10.8 V, this Power Management IC is suitable for a wide range of applications that require stable voltage regulation.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature of 110°C allows this Power Management IC to function reliably even in challenging environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that this Power Management IC can perform effectively in cold conditions.

Technical Specifications

Power Management ICs BQ294572DRVT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

25 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

10.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

BQ294572DRVT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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