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BQ25872YFFT

Texas Instruments

BQ25872YFFT by Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 42; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$4.130

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 248 parts In-Stock

1+ parts

$1.020

100+ parts

-

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248

$1.020

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Texas Instruments

USA . 6,275 parts In-Stock

1+ parts

$3.321

100+ parts

$2.910

1k+ parts

$1.644

10k+ parts

-

6,275

$3.321

$2.910

$1.644

-

Mouser Electronics

USA . 225 parts In-Stock

1+ parts

$4.940

100+ parts

$3.100

1k+ parts

$2.260

10k+ parts

$2.230

225

$4.940

$3.100

$2.260

$2.230

Element14

Singapore . 248 parts In-Stock

1+ parts

$57.170

100+ parts

-

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248

$57.170

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Distributors (In-Stock)

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Digiode

USA . 2,049 parts In-Stock

1+ parts

$0.969

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2,049

$0.969

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Vyrian

USA . 8,999 parts In-Stock

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8,999

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Distributors (Availability)

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Semicontronic

India . 1,332 parts In-Stock

1+ parts

$0.870

100+ parts

$0.848

1k+ parts

$0.844

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-

1,332

$0.870

$0.848

$0.844

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Ampacity Inc.

Singapore . 1,192 parts In-Stock

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$0.870

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$0.870

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Corphita

USA . 956 parts In-Stock

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$0.918

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956

$0.918

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Continental Prestige Electronics

USA . 248 parts In-Stock

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$1.020

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248

$1.020

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Corohmni

South Africa . 233 parts In-Stock

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$1.020

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Native Components

USA . 682 parts In-Stock

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$1.250

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682

$1.250

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Northwest PG Solutions

USA . 425 parts In-Stock

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$1.375

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425

$1.375

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Component Stockers USA

USA . 6,264 parts In-Stock

1+ parts

$4.330

100+ parts

$3.190

1k+ parts

$1.780

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6,264

$4.330

$3.190

$1.780

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Parana Technologies

USA . 1,164 parts In-Stock

1+ parts

$6.684

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$7.382

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1,164

$6.684

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$7.382

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DigiPath Technology Company

USA . 1,455 parts In-Stock

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$7.360

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1,455

$7.360

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ChromeModa Solutions

Germany . 6,497 parts In-Stock

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$7.510

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$6.158

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6,497

$7.510

$6.158

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IDEA Electronic Components Group

UK . 840 parts In-Stock

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$7.510

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$6.759

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840

$7.510

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$6.759

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QUARKTWIN TECHNOLOGY LTD

USA . 3,839 parts In-Stock

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3,839

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Perfect Parts

USA . 560 parts In-Stock

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560

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Technical Specifications

Power Management ICs BQ25872YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.415 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.4 mm

Trade Compliance

BQ25872YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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