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BQ25871YFFR

Texas Instruments

BQ25871YFFR by Texas Instruments

BQ25871YFFR by Texas Instruments is a Power Management IC with 42 terminals, operating temperature range of -40 to 85°C, and supply voltage from 2.8V to 6V. It is used in industrial applications for power supply support circuits due to its adjustable threshold feature and compact rectangular package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,863 parts In-Stock

1+ parts

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5,863

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Digiode

USA . 4,458 parts In-Stock

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4,458

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 800 parts In-Stock

1+ parts

$0.727

100+ parts

-

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800

$0.727

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Northwest PG Solutions

USA . 1,821 parts In-Stock

1+ parts

$0.799

100+ parts

-

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1,821

$0.799

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Ampacity Inc.

Singapore . 1,596 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,596

$3.500

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One Stop Electronics

USA . 956 parts In-Stock

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$4.500

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956

$4.500

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Semicontronic

India . 1,573 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

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1,573

$6.500

$6.338

$6.305

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Parana Technologies

USA . 295 parts In-Stock

1+ parts

$11.492

100+ parts

-

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$11.904

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295

$11.492

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$11.904

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AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$11.508

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824

$11.508

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Microchip USA

USA . 2,203 parts In-Stock

1+ parts

$11.960

100+ parts

$11.890

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$11.850

10k+ parts

$11.810

2,203

$11.960

$11.890

$11.850

$11.810

DigiPath Technology Company

USA . 195 parts In-Stock

1+ parts

$12.654

100+ parts

$11.641

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195

$12.654

$11.641

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ChromeModa Solutions

Germany . 4,302 parts In-Stock

1+ parts

$12.912

100+ parts

$10.588

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4,302

$12.912

$10.588

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

1+ parts

$12.912

100+ parts

$12.266

1k+ parts

$11.621

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1,214

$12.912

$12.266

$11.621

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Corohmni

South Africa . 494 parts In-Stock

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494

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Corphita

USA . 247 parts In-Stock

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247

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Overview

Elevate your power management game with the BQ25871YFFR by Texas Instruments. Designed with precision and cutting-edge technology, this Power Management IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this product is a game-changer in the industry. With Texas Instruments' reputation for excellence and innovation, you can trust that you are getting a top-of-the-line solution for all your power management needs. Experience the value and benefits that this product brings to the table, and take your projects to the next level with the BQ25871YFFR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body offers durability and protection to the internal components of the IC, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable means easy integration onto PCBs, simplifying the manufacturing process and saving space in the final product design.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6V nominal supply voltage provides a stable power source for the Power Management IC, ensuring reliable performance in powering connected devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this Power Management IC can withstand challenging industrial environments without compromising its functionality.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper ensures good conductivity and resistance to corrosion, maintaining efficient electrical connections over time.

Width (mm): 2.4 mm

The compact width of 2.4mm allows for space-efficient placement on the PCB, ideal for applications where board real estate is limited.

Minimum Supply Voltage (Vsup): 2.8 V

The 2.8V minimum supply voltage capability provides flexibility in power source options, accommodating a range of input voltages while delivering consistent performance.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating indicates that this Power Management IC is designed to operate reliably in harsh temperature conditions typically found in industrial settings.

Technical Specifications

Power Management ICs BQ25871YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B42

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.415 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.4 mm

Trade Compliance

BQ25871YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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