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BQ25123YFPR

Texas Instruments

BQ25123YFPR by Texas Instruments

BQ25123YFPR by Texas Instruments is a Power Management IC with 25 terminals, operating temperature range of -40 to 85°C. It features a nominal voltage of 5V, adjustable threshold, and industrial temperature grade. Ideal for power supply management circuits in applications requiring precise voltage regulation and thermal performance.

Median Price

$2.828

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,075 parts In-Stock

1+ parts

$2.828

100+ parts

$2.478

1k+ parts

$1.400

10k+ parts

-

11,075

$2.828

$2.478

$1.400

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,102 parts In-Stock

1+ parts

$2.687

100+ parts

-

1k+ parts

-

10k+ parts

-

3,102

$2.687

-

-

-

Vyrian

USA . 2,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 740 parts In-Stock

1+ parts

$0.277

100+ parts

-

1k+ parts

-

10k+ parts

$0.266

740

$0.277

-

-

$0.266

Northwest PG Solutions

USA . 1,932 parts In-Stock

1+ parts

$0.305

100+ parts

-

1k+ parts

-

10k+ parts

$0.269

1,932

$0.305

-

-

$0.269

Semicontronic

India . 10,999 parts In-Stock

1+ parts

$2.400

100+ parts

$2.340

1k+ parts

$2.328

10k+ parts

-

10,999

$2.400

$2.340

$2.328

-

Ampacity Inc.

Singapore . 10,737 parts In-Stock

1+ parts

$2.400

100+ parts

-

1k+ parts

-

10k+ parts

-

10,737

$2.400

-

-

-

Corphita

USA . 369 parts In-Stock

1+ parts

$2.545

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$2.545

-

-

-

Corohmni

South Africa . 325 parts In-Stock

1+ parts

$2.828

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$2.828

-

-

-

Microchip USA

USA . 5,558 parts In-Stock

1+ parts

$12.470

100+ parts

$12.390

1k+ parts

$12.350

10k+ parts

$12.310

5,558

$12.470

$12.390

$12.350

$12.310

AZTECH Wire

Italy . 919 parts In-Stock

1+ parts

$17.600

100+ parts

-

1k+ parts

-

10k+ parts

-

919

$17.600

-

-

-

Parana Technologies

USA . 638 parts In-Stock

1+ parts

$18.451

100+ parts

-

1k+ parts

$18.568

10k+ parts

-

638

$18.451

-

$18.568

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DigiPath Technology Company

USA . 1,170 parts In-Stock

1+ parts

$20.317

100+ parts

$18.692

1k+ parts

-

10k+ parts

-

1,170

$20.317

$18.692

-

-

ChromeModa Solutions

Germany . 2,815 parts In-Stock

1+ parts

$20.732

100+ parts

$17.000

1k+ parts

-

10k+ parts

-

2,815

$20.732

$17.000

-

-

IDEA Electronic Components Group

UK . 1,747 parts In-Stock

1+ parts

$20.732

100+ parts

$19.695

1k+ parts

$18.659

10k+ parts

-

1,747

$20.732

$19.695

$18.659

-

Overview

Unlock the power of efficient energy management with the BQ25123YFPR by Texas Instruments. As a leader in Power Management ICs, Texas Instruments delivers superior quality and reliability. Ideal for a wide range of applications, this product offers customers unmatched value with its precise voltage control and advanced thermal management features. Say goodbye to energy wastage and hello to optimized performance with the BQ25123YFPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a cost-effective and lightweight option for the package, making the product portable and affordable.

Surface Mount: YES

Enables easy installation on PCBs, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard power sources, ensuring universal usability.

No. of Terminals: 25

Offers ample connections for various components, facilitating a versatile design.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

Width (mm): 2.468 mm

Compact size allows for space-efficient placement on the PCB, ideal for small-scale applications.

Other IC Type: POWER SUPPLY MANAGEMENT CIRCUIT

Specialized for efficient power management, enhancing the overall functionality of the product.

Minimum Supply Voltage (Vsup): 3.4 V

Supports a lower input voltage range, accommodating various power sources.

Maximum Seated Height: 0.5 mm

Ultra-thin profile enables a slim design, suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended operating temperature ranges, ensuring robust performance.

No. of Channels: 3

Multiple channels allow for efficient distribution and management of power within the system.

Terminal Pitch: 0.4 mm

Fine pitch terminals enable precise connections, enhancing reliability in high-speed data transmission.

Maximum Supply Voltage (Vsup): 5.5 V

Provides a stable power input range, minimizing the risk of overloading or voltage spikes.

Adjustable Threshold: YES

Allows for customizable voltage thresholds, catering to specific application requirements.

Technical Specifications

Power Management ICs BQ25123YFPR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PBGA-B25

JESD-609 Code:

e1

Length:

2.53 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA25,5X5,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+0.12V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.468 mm

Trade Compliance

BQ25123YFPR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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