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BQ24251YFFR

Texas Instruments

BQ24251YFFR by Texas Instruments

BQ24251YFFR by Texas Instruments is a Power Management IC with 30 terminals in a rectangular package. It operates b/w -40 to 85°C, with a supply voltage range of 4.5-10V. Ideal for industrial applications requiring power supply management circuits.

Median Price

$2.388

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 743 parts In-Stock

1+ parts

-

100+ parts

$2.140

1k+ parts

$1.910

10k+ parts

$1.800

743

-

$2.140

$1.910

$1.800

DigiKey

USA . 743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.810

10k+ parts

-

743

-

-

$2.810

-

Verical

USA . 743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.388

10k+ parts

$2.250

743

-

-

$2.388

$2.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,298 parts In-Stock

1+ parts

$2.004

100+ parts

-

1k+ parts

-

10k+ parts

-

1,298

$2.004

-

-

-

Vyrian

USA . 3,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,029

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 729 parts In-Stock

1+ parts

$1.790

100+ parts

$1.745

1k+ parts

$1.736

10k+ parts

-

729

$1.790

$1.745

$1.736

-

Ampacity Inc.

Singapore . 640 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

-

10k+ parts

-

640

$1.790

-

-

-

Corphita

USA . 3,718 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

-

10k+ parts

-

3,718

$1.899

-

-

-

Corohmni

South Africa . 210 parts In-Stock

1+ parts

$2.110

100+ parts

-

1k+ parts

-

10k+ parts

-

210

$2.110

-

-

-

Parana Technologies

USA . 1,363 parts In-Stock

1+ parts

$5.652

100+ parts

-

1k+ parts

$6.446

10k+ parts

-

1,363

$5.652

-

$6.446

-

DigiPath Technology Company

USA . 905 parts In-Stock

1+ parts

$6.223

100+ parts

$5.725

1k+ parts

-

10k+ parts

-

905

$6.223

$5.725

-

-

ChromeModa Solutions

Germany . 1,888 parts In-Stock

1+ parts

$6.350

100+ parts

$5.207

1k+ parts

-

10k+ parts

-

1,888

$6.350

$5.207

-

-

IDEA Electronic Components Group

UK . 961 parts In-Stock

1+ parts

$6.350

100+ parts

-

1k+ parts

$5.715

10k+ parts

-

961

$6.350

-

$5.715

-

Microchip USA

USA . 368 parts In-Stock

1+ parts

$13.710

100+ parts

$13.670

1k+ parts

$13.670

10k+ parts

$13.630

368

$13.710

$13.670

$13.670

$13.630

Northwest PG Solutions

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

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2,016

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-

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Native Components

USA . 547 parts In-Stock

1+ parts

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547

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Perfect Parts

USA . 27 parts In-Stock

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27

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Overview

Unlock the full potential of your power management system with the BQ24251YFFR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are essential for a wide range of applications. This sleek and efficient RECTANGULAR package offers customers a reliable solution for their power supply management needs. With a temperature range suitable for industrial use and a low supply current, this product provides unmatched value and performance. Trust Texas Instruments to provide you with the cutting-edge technology you need to power your innovations.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard board layouts and maximizes space utilization.

Power Supplies (V): 4.5/10

Supports a wide range of power supply voltages, making it versatile for various applications.

No. of Terminals: 30

Sufficient number of terminals for connecting to multiple components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with very thin profile and fine pitch enables high density mounting and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

Can operate reliably in high temperature conditions, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

Provides strong and reliable electrical connections while resisting corrosion for long-term durability.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Specifically designed for power supply management tasks, ensuring optimal performance and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during assembly process.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during soldering without damage or degradation.

Nominal Threshold Voltage (V): +3.35V

Precise threshold voltage for accurate power management and control.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards for reliable operation in harsh environments.

Maximum Supply Current (Isup): 5 mA

Low supply current consumption for efficient power utilization and minimal heat generation.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates automated soldering processes.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for compact layout design and high density mounting on PCBs.

Technical Specifications

Power Management ICs BQ24251YFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA30,5X6,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/10

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+3.35V

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ24251YFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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