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BQ24170RGYT

Texas Instruments

BQ24170RGYT by Texas Instruments

BQ24170RGYT by Texas Instruments is a Power Management IC with 24 terminals, operating temperature range of -40 to 85°C, and PWM control technique. It supports a max output current of 4A, switching frequency up to 1840 kHz, and is ideal for industrial applications requiring power supply support circuits.

Median Price

$4.204

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 141 parts In-Stock

1+ parts

$2.573

100+ parts

$2.448

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141

$2.573

$2.448

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Texas Instruments

USA . 34,569 parts In-Stock

1+ parts

$4.204

100+ parts

$3.683

1k+ parts

$2.081

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34,569

$4.204

$3.683

$2.081

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Mouser Electronics

USA . 523 parts In-Stock

1+ parts

$5.070

100+ parts

$3.240

1k+ parts

$2.850

10k+ parts

$2.820

523

$5.070

$3.240

$2.850

$2.820

DigiKey

USA . 424 parts In-Stock

1+ parts

$5.070

100+ parts

$3.235

1k+ parts

$2.934

10k+ parts

$2.820

424

$5.070

$3.235

$2.934

$2.820

Verical

USA . 141 parts In-Stock

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-

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$2.448

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141

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$2.448

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Distributors (In-Stock)

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Digiode

USA . 2,782 parts In-Stock

1+ parts

$2.014

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-

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2,782

$2.014

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$3.653

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870

$3.653

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Bristol Electronics

USA . 88 parts In-Stock

1+ parts

$4.834

100+ parts

$2.272

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88

$4.834

$2.272

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Chip Stock

USA . 45,120 parts In-Stock

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Vyrian

USA . 8,416 parts In-Stock

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VNN

France . 1,596 parts In-Stock

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Martec Srl

Italy . 1,539 parts In-Stock

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Cyclops Electronics Ltd

UK . 241 parts In-Stock

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241

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Dan-Mar Components

USA . 88 parts In-Stock

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88

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LWI Electronics Inc

India . 50 parts In-Stock

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50

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6,866 parts In-Stock

1+ parts

$1.610

100+ parts

$1.570

1k+ parts

$1.562

10k+ parts

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6,866

$1.610

$1.570

$1.562

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Corphita

USA . 4,994 parts In-Stock

1+ parts

$1.908

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$1.908

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Ampacity Inc.

Singapore . 7,129 parts In-Stock

1+ parts

$3.510

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7,129

$3.510

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$3.580

100+ parts

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$3.437

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2,000

$3.580

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$3.437

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Continental Prestige Electronics

USA . 4,428 parts In-Stock

1+ parts

$3.653

100+ parts

-

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$3.580

4,428

$3.653

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$3.580

Argo Parts USA

USA . 516 parts In-Stock

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$3.653

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516

$3.653

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Parana Technologies

USA . 2,183 parts In-Stock

1+ parts

$7.177

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$7.685

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2,183

$7.177

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$7.685

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DigiPath Technology Company

USA . 1,447 parts In-Stock

1+ parts

$7.903

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$7.271

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1,447

$7.903

$7.271

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IDEA Electronic Components Group

UK . 2,263 parts In-Stock

1+ parts

$8.064

100+ parts

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$7.258

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2,263

$8.064

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$7.258

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ChromeModa Solutions

Germany . 723 parts In-Stock

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$8.064

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$6.612

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723

$8.064

$6.612

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Corohmni

South Africa . 185 parts In-Stock

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$14.404

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Kepictronics

USA . 12,004 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,496 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,164 parts In-Stock

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Authorized Procurement Solutions

USA . 216 parts In-Stock

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GreenTree Electronics

Israel . 216 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the BQ24170RGYT Power Management IC. This versatile chip carrier is designed to optimize power supply support circuits with a wide range of applications, ensuring optimal performance in industrial settings. With a maximum output current of 4A and pulse width modulation control technique, this innovative solution offers customers unmatched value and benefits. Trust Texas Instruments to provide cutting-edge technology for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides durability and protection for the Power Management IC.

Surface Mount: YES

The surface mount feature allows for easy and secure mounting onto PCBs, saving space and facilitating assembly.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and easy integration into electronic systems.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in various environments, from extreme cold to industrial heat.

Maximum Output Current: 4 A

The high output current capability makes this Power Management IC suitable for powering various devices and systems.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers efficient power conversion and regulation, ensuring stable performance.

Technical Specifications

Power Management ICs BQ24170RGYT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

17 V

Minimum Input Voltage:

4.5 V

JESD-30 Code:

R-PQCC-N24

JESD-609 Code:

e4

Length:

5.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1840 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.6V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.5 mm

Trade Compliance

BQ24170RGYT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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