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BQ24168RGER

Texas Instruments

BQ24168RGER by Texas Instruments

BQ24168RGER by Texas Instruments is a Power Management IC with 24 terminals, operating b/w -40 to 85°C. It has a nominal voltage of 5V and supports a max supply current of 5mA. Ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

$3.469

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,027 parts In-Stock

1+ parts

$4.000

100+ parts

$3.505

1k+ parts

$1.980

10k+ parts

-

9,027

$4.000

$3.505

$1.980

-

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$2.850

1k+ parts

$2.550

10k+ parts

$2.400

9,000

-

$2.850

$2.550

$2.400

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

-

10k+ parts

-

9,000

-

$3.750

-

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.188

10k+ parts

$3.000

6,000

-

-

$3.188

$3.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 448 parts In-Stock

1+ parts

$2.612

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$2.612

-

-

-

Vyrian

USA . 8,770 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,770

-

-

-

-

Chip Stock

USA . 3,499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,499

-

-

-

-

Bristol Electronics

USA . 227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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227

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 8,582 parts In-Stock

1+ parts

$2.340

100+ parts

$2.282

1k+ parts

$2.270

10k+ parts

-

8,582

$2.340

$2.282

$2.270

-

Corphita

USA . 3,612 parts In-Stock

1+ parts

$2.475

100+ parts

-

1k+ parts

-

10k+ parts

-

3,612

$2.475

-

-

-

Corohmni

South Africa . 378 parts In-Stock

1+ parts

$2.750

100+ parts

-

1k+ parts

-

10k+ parts

-

378

$2.750

-

-

-

Parana Technologies

USA . 1,410 parts In-Stock

1+ parts

$7.447

100+ parts

-

1k+ parts

$7.935

10k+ parts

-

1,410

$7.447

-

$7.935

-

ChromeModa Solutions

Germany . 5,519 parts In-Stock

1+ parts

$8.367

100+ parts

$6.861

1k+ parts

-

10k+ parts

-

5,519

$8.367

$6.861

-

-

IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$8.367

100+ parts

$7.949

1k+ parts

$7.530

10k+ parts

-

27

$8.367

$7.949

$7.530

-

DigiPath Technology Company

USA . 793 parts In-Stock

1+ parts

-

100+ parts

$7.544

1k+ parts

-

10k+ parts

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793

-

$7.544

-

-

Native Components

USA . 663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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663

-

-

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-

Northwest PG Solutions

USA . 159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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159

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-

-

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Overview

Discover the BQ24168RGER by Texas Instruments, a top-tier Power Management IC that promises unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product is designed to meet the highest standards in power management. With a wide range of applications in various industries, this chip carrier offers superior performance and efficiency, making it an ideal choice for all your power supply support circuit needs. Trust Texas Instruments to provide you with cutting-edge technology that delivers exceptional value and benefits. Experience the advantages of the BQ24168RGER today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various operating conditions, making the product reliable.

Surface Mount: YES

Being surface mountable makes installation easier and allows for a more compact design.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can be used in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The product can also function in extremely cold temperatures, providing versatility in operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This finish provides good conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Switcher Config: BUCK

The buck configuration allows for efficient voltage regulation and power management, increasing the product's energy efficiency.

Technical Specifications

Power Management ICs BQ24168RGER attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+3.8V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4 mm

Trade Compliance

BQ24168RGER Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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