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BQ24167YFFT

Texas Instruments

BQ24167YFFT by Texas Instruments

BQ24167YFFT by Texas Instruments is a Power Management IC with 49 terminals in a square package. It operates b/w -40 to 85°C, supporting supply voltages from 4.2V to 10V. Ideal for industrial applications, it features a BUCK switcher configuration and adjustable threshold for power supply support circuits.

Median Price

$8.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 416 parts In-Stock

1+ parts

-

100+ parts

$6.440

1k+ parts

$5.760

10k+ parts

$5.420

416

-

$6.440

$5.760

$5.420

DigiKey

USA . 416 parts In-Stock

1+ parts

-

100+ parts

$8.480

1k+ parts

-

10k+ parts

-

416

-

$8.480

-

-

Verical

USA . 242 parts In-Stock

1+ parts

-

100+ parts

$8.050

1k+ parts

$7.200

10k+ parts

$6.775

242

-

$8.050

$7.200

$6.775

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,180 parts In-Stock

1+ parts

$6.792

100+ parts

-

1k+ parts

-

10k+ parts

-

3,180

$6.792

-

-

-

Vyrian

USA . 6,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,769

-

-

-

-

DigiKey Marketplace

USA . 417 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

417

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 43 parts In-Stock

1+ parts

$5.615

100+ parts

-

1k+ parts

-

10k+ parts

-

43

$5.615

-

-

-

Ampacity Inc.

Singapore . 416 parts In-Stock

1+ parts

$6.080

100+ parts

-

1k+ parts

-

10k+ parts

-

416

$6.080

-

-

-

Corphita

USA . 63 parts In-Stock

1+ parts

$6.435

100+ parts

-

1k+ parts

-

10k+ parts

-

63

$6.435

-

-

-

Parana Technologies

USA . 734 parts In-Stock

1+ parts

$17.105

100+ parts

-

1k+ parts

$17.319

10k+ parts

-

734

$17.105

-

$17.319

-

DigiPath Technology Company

USA . 974 parts In-Stock

1+ parts

$18.835

100+ parts

-

1k+ parts

-

10k+ parts

-

974

$18.835

-

-

-

ChromeModa Solutions

Germany . 3,962 parts In-Stock

1+ parts

$19.219

100+ parts

$15.760

1k+ parts

-

10k+ parts

-

3,962

$19.219

$15.760

-

-

IDEA Electronic Components Group

UK . 790 parts In-Stock

1+ parts

$19.219

100+ parts

$18.258

1k+ parts

$17.297

10k+ parts

-

790

$19.219

$18.258

$17.297

-

Microchip USA

USA . 1,688 parts In-Stock

1+ parts

$23.010

100+ parts

$22.680

1k+ parts

$22.520

10k+ parts

$22.360

1,688

$23.010

$22.680

$22.520

$22.360

Perfect Parts

USA . 1,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,497

-

-

-

-

Northwest PG Solutions

USA . 601 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.503

10k+ parts

-

601

-

-

$5.503

-

Robosynatics

Brazil . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$7.595

1k+ parts

$7.033

10k+ parts

$7.033

300

-

$7.595

$7.033

$7.033

Overview

Discover the cutting-edge BQ24167YFFT by Texas Instruments, a top-tier Power Management IC designed for high-performance applications. With Texas Instruments' renowned reputation for quality and reliability, this product offers unmatched value and benefits to customers. Ideal for a wide range of power management needs, this IC provides efficient and precise control without compromising on performance. Elevate your projects with the BQ24167YFFT and experience the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly.

Package Shape: SQUARE

The square shape helps in optimizing space on the PCB layout.

No. of Terminals: 49

Plenty of terminals for connecting multiple components, providing flexibility in design.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position makes soldering and connection easier during assembly.

Width (mm): 2.8 mm

Narrow width helps in saving space on the PCB and allows for compact designs.

Minimum Supply Voltage (Vsup): 4.2 V

Low minimum supply voltage enables operation even with low-power sources.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh industrial environments.

Switcher Config: BUCK

BUCK configuration allows for efficient power conversion, making the product energy-efficient.

Technical Specifications

Power Management ICs BQ24167YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B49

JESD-609 Code:

e1

Length:

2.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

49

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

4.2 V

Surface Mount:

YES

Switcher Config:

BUCK

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2.8 mm

Trade Compliance

BQ24167YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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