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BQ24103ARHLRG4

Texas Instruments

BQ24103ARHLRG4 by Texas Instruments

BQ24103ARHLRG4 by Texas Instruments is a voltage-mode power management IC with a max output current of 4.5A and switching frequency of 1100kHz. Ideal for industrial applications, it operates b/w -40 to 85°C, supporting a min input voltage of 4.35V and nominal output voltage of 4.2V.

Median Price

$1.882

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 900 parts In-Stock

1+ parts

$1.893

100+ parts

$1.871

1k+ parts

$1.860

10k+ parts

-

900

$1.893

$1.871

$1.860

-

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$1.871

1k+ parts

$1.860

10k+ parts

-

900

-

$1.871

$1.860

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,800 parts In-Stock

1+ parts

$3.245

100+ parts

-

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-

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3,800

$3.245

-

-

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Vyrian

USA . 9,667 parts In-Stock

1+ parts

-

100+ parts

-

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9,667

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-

-

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VNN

France . 1,802 parts In-Stock

1+ parts

-

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-

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1,802

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-

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

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-

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300

-

-

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Distributors (Availability)

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Ampacity Inc.

Singapore . 860 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

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860

$2.000

-

-

-

Semicontronic

India . 819 parts In-Stock

1+ parts

$2.000

100+ parts

$1.950

1k+ parts

$1.940

10k+ parts

-

819

$2.000

$1.950

$1.940

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Corphita

USA . 1,346 parts In-Stock

1+ parts

$3.074

100+ parts

-

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1,346

$3.074

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-

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Corohmni

South Africa . 75 parts In-Stock

1+ parts

$7.446

100+ parts

-

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75

$7.446

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Parana Technologies

USA . 1,105 parts In-Stock

1+ parts

$15.536

100+ parts

-

1k+ parts

$15.911

10k+ parts

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1,105

$15.536

-

$15.911

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DigiPath Technology Company

USA . 706 parts In-Stock

1+ parts

$17.107

100+ parts

$15.738

1k+ parts

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10k+ parts

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706

$17.107

$15.738

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-

ChromeModa Solutions

Germany . 3,445 parts In-Stock

1+ parts

$17.456

100+ parts

$14.314

1k+ parts

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10k+ parts

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3,445

$17.456

$14.314

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

1+ parts

$17.456

100+ parts

$16.583

1k+ parts

$15.710

10k+ parts

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1,167

$17.456

$16.583

$15.710

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AZTECH Wire

Italy . 1,185 parts In-Stock

1+ parts

$19.960

100+ parts

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1,185

$19.960

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QUARKTWIN TECHNOLOGY LTD

USA . 22,533 parts In-Stock

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22,533

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Kepictronics

USA . 8,260 parts In-Stock

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8,260

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Continental Prestige Electronics

USA . 3,276 parts In-Stock

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3,276

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Microchip USA

USA . 2,044 parts In-Stock

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2,044

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Argo Parts USA

USA . 784 parts In-Stock

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784

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Bastille Electronics

Australia . 40 parts In-Stock

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40

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Overview

Experience superior power management with the BQ24103ARHLRG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions in the Power Management ICs category. This chip carrier with a heat sink/slug package style offers customers unparalleled value with its voltage-mode control technique and buck switcher configuration. Whether you're looking to optimize power supply support circuits or enhance industrial-grade applications, the BQ24103ARHLRG4 provides a maximum output current of 4.5A and a wide operating temperature range from -40°C to 85°C. Trust Texas Instruments for cutting-edge power management solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it a good choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, making this product a convenient choice for assembly.

Package Shape: RECTANGULAR

The rectangular shape makes the product compatible with standard mounting options, making it versatile and suitable for various applications.

No. of Terminals: 20

With a high number of terminals, this product offers multiple connectivity options, enhancing its functionality and usability.

Package Style: CHIP CARRIER, HEAT SINK/SLUG

This style combination ensures effective heat dissipation, improving the overall performance and reliability of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, making it a reliable choice for industrial use.

Control Mode: VOLTAGE-MODE

The voltage-mode control technique enables precise regulation, ensuring stable and efficient power management.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows this product to function reliably in extreme cold environments, expanding its utility.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides excellent conductivity and corrosion resistance, extending the lifespan of the product.

Terminal Position: QUAD

The quad terminal position offers enhanced connectivity options, allowing for versatile and flexible installation methods.

Technical Specifications

Power Management ICs BQ24103ARHLRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

4.35 V

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

4.5 A

Nominal Output Voltage:

4.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.35 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1100 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

BQ24103ARHLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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