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BQ24014DRCRG4

Texas Instruments

BQ24014DRCRG4 by Texas Instruments

BQ24014DRCRG4 by Texas Instruments is a Power Management IC with 10 terminals, operating b/w -40 to 85 °C. It supports supply voltages from 3V to 16.5V and has a max supply current of 5mA. Ideal for industrial applications requiring compact, surface-mount power supply support circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,284 parts In-Stock

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8,284

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Digiode

USA . 801 parts In-Stock

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801

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Ampacity Inc.

Singapore . 1,170 parts In-Stock

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$0.500

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1,170

$0.500

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Native Components

USA . 815 parts In-Stock

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$0.957

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815

$0.957

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Northwest PG Solutions

USA . 59 parts In-Stock

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$1.053

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59

$1.053

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Semicontronic

India . 1,209 parts In-Stock

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$5.500

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$5.362

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$5.335

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$5.362

$5.335

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One Stop Electronics

USA . 839 parts In-Stock

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$5.500

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839

$5.500

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Parana Technologies

USA . 266 parts In-Stock

1+ parts

$8.999

100+ parts

$835.674

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$8.099

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266

$8.999

$835.674

$8.099

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DigiPath Technology Company

USA . 619 parts In-Stock

1+ parts

$9.909

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619

$9.909

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ChromeModa Solutions

Germany . 2,334 parts In-Stock

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$10.111

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$8.291

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2,334

$10.111

$8.291

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IDEA Electronic Components Group

UK . 595 parts In-Stock

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$10.111

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$9.605

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$9.100

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595

$10.111

$9.605

$9.100

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AZTECH Wire

Italy . 236 parts In-Stock

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$11.618

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Component Stockers USA

USA . 3,804 parts In-Stock

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$20.190

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 1,821 parts In-Stock

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Corphita

USA . 759 parts In-Stock

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Kepictronics

USA . 350 parts In-Stock

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Corohmni

South Africa . 292 parts In-Stock

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Overview

Enhance your power management solutions with the BQ24014DRCRG4 by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers innovative Power Management ICs like no other. This compact and efficient device boasts a wide range of applications, making it a versatile choice for various projects. With a nominal supply voltage of 4.5V and maximum operating temperature of 85°C, this IC offers exceptional performance in industrial settings. Trust Texas Instruments to provide cutting-edge technology that is designed to meet your power management needs seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ensuring the IC's reliability in various applications.

Surface Mount: YES

Being surface mountable, this IC is easy to install on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V ensures compatibility with a wide range of devices and power sources.

Power Supplies (V): 3/16.5

Supports a range of power supplies from 3V to 16.5V, making it versatile for different power requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can perform reliably in challenging environments.

Width (mm): 3 mm

The compact width of 3mm allows for efficient use of board space and integration into tight designs.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures efficient power usage and compatibility with lower voltage systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables the IC to withstand soldering processes without damage.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can operate reliably in harsh conditions and demanding environments.

Maximum Supply Current (Isup): 5 mA

With a maximum supply current of 5mA, this IC is efficient in power consumption and suitable for low-power devices.

Technical Specifications

Power Management ICs BQ24014DRCRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/16.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

BQ24014DRCRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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