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BQ2202SNTR

Texas Instruments

BQ2202SNTR by Texas Instruments

BQ2202SNTR by Texas Instruments is a Power Management IC with 16 terminals, operating at 5V. It has an adjustable threshold and supports power supply circuits. With a small outline package style, it is suitable for applications requiring a nominal voltage of 5V in commercial temperature grades.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,857 parts In-Stock

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Digiode

USA . 1,292 parts In-Stock

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PC Components Company LLC

USA . 939 parts In-Stock

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Bristol Electronics

USA . 939 parts In-Stock

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One Stop Electronics

USA . 1,245 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 521 parts In-Stock

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$7.677

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Parana Technologies

USA . 1,512 parts In-Stock

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$8.912

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$9.586

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$8.912

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DigiPath Technology Company

USA . 988 parts In-Stock

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$9.814

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$9.029

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988

$9.814

$9.029

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ChromeModa Solutions

Germany . 4,243 parts In-Stock

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$10.014

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$8.211

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$10.014

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IDEA Electronic Components Group

UK . 981 parts In-Stock

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$10.014

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$9.513

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$9.013

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981

$10.014

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$9.013

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Native Components

USA . 308 parts In-Stock

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$406.277

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$398.152

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$394.089

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$390.026

308

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$398.152

$394.089

$390.026

Northwest PG Solutions

USA . 1,171 parts In-Stock

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$446.905

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Corphita

USA . 2,133 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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$21.369

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$19.788

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$19.788

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$19.788

Lucentia Tech

USA . 500 parts In-Stock

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$21.369

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$19.788

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$19.788

500

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$21.369

$19.788

$19.788

Overview

Elevate your power management capabilities with the BQ2202SNTR by Texas Instruments. Crafted with precision and expertise, this power management IC offers unparalleled reliability and efficiency. Ideal for a wide range of applications, this innovative product delivers seamless performance and optimal power supply support. Experience the value of superior quality and advanced technology with the BQ2202SNTR, where every detail is designed to enhance your experience and exceed your expectations. Unlock a new level of power management possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and reliability for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Nominal Supply Voltage (Vsup): 5 V

Suitable 5V supply voltage ensures compatibility with a wide range of electronic devices.

No. of Terminals: 16

Having 16 terminals offers versatility in connecting to various components within a circuit.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance in demanding conditions.

Technical Specifications

Power Management ICs BQ2202SNTR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

Length:

9.9695 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.778 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

6 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.94 mm

Trade Compliance

BQ2202SNTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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