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BQ2201SNG4

Texas Instruments

BQ2201SNG4 by Texas Instruments

BQ2201SNG4 by Texas Instruments is a Power Management IC with 5V supply voltage, 8 terminals, and CMOS technology. It is used in power supply support circuits due to its adjustable threshold feature and small outline package style. Operating temperature ranges from 0°C to 70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,835 parts In-Stock

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Digiode

USA . 3,257 parts In-Stock

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Semicontronic

India . 1,239 parts In-Stock

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$2.500

100+ parts

$2.438

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$2.425

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1,239

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,282 parts In-Stock

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$5.500

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One Stop Electronics

USA . 917 parts In-Stock

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$6.500

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917

$6.500

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AZTECH Wire

Italy . 715 parts In-Stock

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$10.254

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715

$10.254

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Parana Technologies

USA . 2,172 parts In-Stock

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$16.024

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$16.366

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2,172

$16.024

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ChromeModa Solutions

Germany . 2,371 parts In-Stock

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$18.004

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$14.763

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$18.004

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IDEA Electronic Components Group

UK . 143 parts In-Stock

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$18.004

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$17.104

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$16.204

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143

$18.004

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Component Stockers USA

USA . 364 parts In-Stock

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$99.990

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364

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QUARKTWIN TECHNOLOGY LTD

USA . 23,032 parts In-Stock

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Corphita

USA . 4,056 parts In-Stock

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Microchip USA

USA . 3,299 parts In-Stock

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DigiPath Technology Company

USA . 2,316 parts In-Stock

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$16.232

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Northwest PG Solutions

USA . 1,652 parts In-Stock

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Native Components

USA . 818 parts In-Stock

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Corohmni

South Africa . 481 parts In-Stock

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Perfect Parts

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Overview

Elevate your power management solutions with the BQ2201SNG4 by Texas Instruments. Crafted with precision and quality in mind, this power management IC offers unparalleled reliability and efficiency. Perfect for a wide range of applications, this small outline package features adjustable thresholds and a commercial temperature grade, making it ideal for various electronic devices. Trust in Texas Instruments to deliver innovation and performance, adding exceptional value to your projects. Choose the BQ2201SNG4 for superior power management capabilities that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material is lightweight and durable, making the IC reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage (Vsup): 5 V

Stable 5V supply voltage ensures consistent performance and compatibility with various systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures the IC can perform reliably even in harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers corrosion resistance and excellent electrical conductivity, enhancing the IC's longevity.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, enhancing the efficiency of the power management IC.

Maximum Supply Current (Isup): 5 mA

Low supply current requirement helps in minimizing power consumption and reducing heat generation, making the IC energy-efficient.

Adjustable Threshold: YES

The adjustable threshold feature allows for customized voltage level settings, providing flexibility and adaptability in diverse applications.

Technical Specifications

Power Management ICs BQ2201SNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.8895 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.778 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

BQ2201SNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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