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BQ2003STRG4

Texas Instruments

BQ2003STRG4 by Texas Instruments

BQ2003STRG4 by Texas Instruments is a Power Management IC with 16 terminals, operating at 5V. It features a max switching frequency of 300 kHz and uses Pulse Width Modulation control technique. Ideal for power supply support circuits in commercial applications due to its compact size and efficient performance.

Median Price

$3.949

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$3.510

1k+ parts

$3.140

10k+ parts

$2.950

490

-

$3.510

$3.140

$2.950

Verical

USA . 490 parts In-Stock

1+ parts

-

100+ parts

$4.388

1k+ parts

$3.925

10k+ parts

$3.688

490

-

$4.388

$3.925

$3.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

-

10k+ parts

-

94

$3.080

-

-

-

Digiode

USA . 2,711 parts In-Stock

1+ parts

$3.278

100+ parts

-

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-

10k+ parts

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2,711

$3.278

-

-

-

Chip Stock

USA . 3,162 parts In-Stock

1+ parts

-

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3,162

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Vyrian

USA . 1,920 parts In-Stock

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1,920

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VNN

France . 1,790 parts In-Stock

1+ parts

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1,790

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-

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R&J Components

USA . 1,550 parts In-Stock

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1,550

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 397 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$2.930

-

-

-

Semicontronic

India . 372 parts In-Stock

1+ parts

$2.930

100+ parts

$2.857

1k+ parts

$2.842

10k+ parts

-

372

$2.930

$2.857

$2.842

-

Corohmni

South Africa . 87 parts In-Stock

1+ parts

$3.080

100+ parts

-

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87

$3.080

-

-

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Corphita

USA . 441 parts In-Stock

1+ parts

$3.105

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-

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441

$3.105

-

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AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$19.446

100+ parts

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453

$19.446

-

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Parana Technologies

USA . 193 parts In-Stock

1+ parts

$22.234

100+ parts

-

1k+ parts

$22.897

10k+ parts

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193

$22.234

-

$22.897

-

DigiPath Technology Company

USA . 734 parts In-Stock

1+ parts

$24.482

100+ parts

$22.524

1k+ parts

-

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734

$24.482

$22.524

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ChromeModa Solutions

Germany . 6,705 parts In-Stock

1+ parts

$24.982

100+ parts

$20.485

1k+ parts

-

10k+ parts

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6,705

$24.982

$20.485

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IDEA Electronic Components Group

UK . 775 parts In-Stock

1+ parts

$24.982

100+ parts

$23.733

1k+ parts

$22.484

10k+ parts

-

775

$24.982

$23.733

$22.484

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Continental Prestige Electronics

USA . 6,272 parts In-Stock

1+ parts

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6,272

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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-

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Microchip USA

USA . 3,738 parts In-Stock

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3,738

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Kepictronics

USA . 3,350 parts In-Stock

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3,350

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,419 parts In-Stock

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1,419

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Overview

Unlock the power of efficient energy management with the BQ2003STRG4 by Texas Instruments. Designed with precision and expertise, this Power Management IC offers unparalleled reliability and performance. Ideal for a wide range of applications, this small outline package is perfect for maximizing power supply efficiency. Experience seamless operation and peace of mind knowing that your devices are in good hands with Texas Instruments' top-of-the-line technology. Elevate your energy management system with the BQ2003STRG4 and enjoy the benefits of cutting-edge innovation at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and cost-effective, ideal for mass production.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, compatible with a wide range of applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the IC can withstand challenging environmental conditions.

Maximum Switching Frequency: 300 kHz

High switching frequency allows for efficient power management and regulation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the power management IC.

Technical Specifications

Power Management ICs BQ2003STRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current (Isup):

2.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

300 kHz

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

BQ2003STRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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