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AM1802AZWTD3

Texas Instruments

AM1802AZWTD3 by Texas Instruments

The Texas Instruments AM1802AZWTD3 is a microcontroller with 361 terminals in a grid array package. It features RISC technology, CMOS design, and ball terminal form. Ideal for applications requiring high-performance computing in compact spaces like IoT devices and industrial automation systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,927 parts In-Stock

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Digiode

USA . 57 parts In-Stock

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57

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Distributors (Availability)

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AZTECH Wire

Italy . 781 parts In-Stock

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$16.142

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781

$16.142

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One Stop Electronics

USA . 141 parts In-Stock

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$33.000

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141

$33.000

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Parana Technologies

USA . 2,101 parts In-Stock

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$56.873

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2,101

$56.873

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DigiPath Technology Company

USA . 241 parts In-Stock

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$62.624

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241

$62.624

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ChromeModa Solutions

Germany . 3,027 parts In-Stock

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$63.902

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$52.400

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3,027

$63.902

$52.400

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IDEA Electronic Components Group

UK . 830 parts In-Stock

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$63.902

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$60.707

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$57.512

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830

$63.902

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$57.512

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Corphita

USA . 3,295 parts In-Stock

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3,295

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Northwest PG Solutions

USA . 2,164 parts In-Stock

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Native Components

USA . 583 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the AM1802AZWTD3 microcontroller. This cutting-edge device offers endless possibilities in a compact package, making it ideal for a wide range of applications. Whether you're designing IoT devices, automotive systems, or industrial automation solutions, this microcontroller delivers unmatched performance and efficiency. Trust in Texas Instruments to provide the technology you need to bring your projects to life. Choose the AM1802AZWTD3 for value, innovation, and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy are commonly used materials for package bodies in microcontrollers, providing good insulation and protection for the internal components.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of microcontrollers onto circuit boards, saving space and enabling higher component density.

Package Shape: SQUARE

A square package shape is often preferred for microcontrollers as it allows for easier layout on circuit boards and efficient use of space.

No. of Terminals: 361

Having a higher number of terminals allows for a greater number of connections and functionalities to be supported, making the microcontroller more versatile and capable.

Package Style (Meter): GRID ARRAY

A grid array package style offers good thermal performance and reliability, making it ideal for high-performance applications where heat dissipation is important.

Terminal Position: BOTTOM

Bottom terminal positioning can improve signal integrity and reduce electromagnetic interference, leading to better overall performance of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

A microcontroller based on Reduced Instruction Set Computing (RISC) architecture typically offers high performance, low power consumption, and efficient instruction execution, making it suitable for a wide range of applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology is known for its low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making it an excellent choice for microcontrollers.

Terminal Form: BALL

Ball terminals allow for reliable and high-density connections, making them suitable for applications where a large number of connections need to be made in a limited space.

Technical Specifications

Microcontrollers AM1802AZWTD3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B361

No. of Terminals:

361

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Trade Compliance

AM1802AZWTD3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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