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AM1802BZCED3

Texas Instruments

AM1802BZCED3 by Texas Instruments

The Texas Instruments AM1802BZCED3 is a 32-bit microcontroller with 23-bit address bus width, operating at up to 30 MHz. It features a package style of grid array, low profile, fine pitch and is suitable for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

$17.880

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,962 parts In-Stock

1+ parts

-

100+ parts

$15.480

1k+ parts

$13.850

10k+ parts

$13.030

6,962

-

$15.480

$13.850

$13.030

DigiKey

USA . 6,962 parts In-Stock

1+ parts

-

100+ parts

$17.880

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6,962

-

$17.880

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Verical

USA . 6,960 parts In-Stock

1+ parts

-

100+ parts

$19.350

1k+ parts

$17.313

10k+ parts

$16.288

6,960

-

$19.350

$17.313

$16.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,907 parts In-Stock

1+ parts

$16.330

100+ parts

-

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1,907

$16.330

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Vyrian

USA . 2,738 parts In-Stock

1+ parts

$17.190

100+ parts

-

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2,738

$17.190

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DigiKey Marketplace

USA . 6,962 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,962

-

-

-

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PC Components Company LLC

USA . 772 parts In-Stock

1+ parts

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772

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Bristol Electronics

USA . 772 parts In-Stock

1+ parts

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772

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 118 parts In-Stock

1+ parts

$9.165

100+ parts

-

1k+ parts

-

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-

118

$9.165

-

-

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Northwest PG Solutions

USA . 974 parts In-Stock

1+ parts

$10.082

100+ parts

$9.074

1k+ parts

-

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974

$10.082

$9.074

-

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Ampacity Inc.

Singapore . 6,613 parts In-Stock

1+ parts

$14.610

100+ parts

-

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6,613

$14.610

-

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Corphita

USA . 3,942 parts In-Stock

1+ parts

$15.471

100+ parts

-

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3,942

$15.471

-

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Parana Technologies

USA . 1,011 parts In-Stock

1+ parts

$73.469

100+ parts

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1,011

$73.469

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DigiPath Technology Company

USA . 645 parts In-Stock

1+ parts

$80.898

100+ parts

$74.426

1k+ parts

-

10k+ parts

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645

$80.898

$74.426

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ChromeModa Solutions

Germany . 4,593 parts In-Stock

1+ parts

$82.549

100+ parts

$67.690

1k+ parts

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10k+ parts

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4,593

$82.549

$67.690

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IDEA Electronic Components Group

UK . 267 parts In-Stock

1+ parts

$82.549

100+ parts

$78.422

1k+ parts

$74.294

10k+ parts

-

267

$82.549

$78.422

$74.294

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

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3,500

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Kepictronics

USA . 950 parts In-Stock

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950

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Microchip USA

USA . 215 parts In-Stock

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215

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Perfect Parts

USA . 40 parts In-Stock

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40

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Overview

Experience the cutting-edge technology of Texas Instruments with the AM1802BZCED3 Microcontroller. This high-quality product offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this microcontroller provides value, efficiency, and versatility. Trust in Texas Instruments for top-of-the-line products that deliver exceptional results every time. Elevate your projects with the AM1802BZCED3 and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the microcontroller easy to handle and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact, space-saving designs and efficient assembly processes.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures the safe operation and protection of the microcontroller.

Address Bus Width: 23

A wider address bus allows for a larger range of memory addresses, enabling more complex and versatile functionalities.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data sets and process information more efficiently.

Power Supplies (V): 1.2,1.8,3.3

Having multiple power supply options allows for flexibility in voltage selection based on the specific requirements of the application.

No. of Terminals: 361

A higher number of terminals provide more connectivity options and expand the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The specific package style ensures a compact form factor, efficient heat dissipation, and easy PCB integration.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V allows for low-power operation and energy-efficient performance.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature ensures reliable performance and suitability for industrial and harsh environment applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the microcontroller suitable for use in extreme temperature conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity, corrosion resistance, and solderability for reliable connections.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and reduce the workload on the CPU, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it convenient for integration into electronic devices.

Maximum Seated Height: 1.3 mm

The low profile design with a maximum seated height of 1.3 mm enables compact and slim product designs.

Width: 13 mm

The compact width of 13 mm allows for space-efficient PCB layout and facilitates integration into various applications.

External Data Bus Width: 16

The external data bus width of 16 bits enables efficient data transfer and processing for enhanced performance.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency of 30 MHz enables fast and responsive operation, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow temperature and time ensure proper soldering and reliable connections during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability under varying temperature conditions.

Length: 13 mm

The compact length of 13 mm allows for space-efficient PCB layout and integration into small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures robust performance and reliability in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers high performance, energy efficiency, and streamlined processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

Ball terminal form offers reliable solder joints and good mechanical strength for secure connections and durability.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2 V ensures stable operation and compatibility with various power sources.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates and customization of the microcontroller's functions.

Terminal Pitch: 0.65 mm

The fine terminal pitch of 0.65 mm enables high-density mounting and compact PCB designs for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during assembly and storage.

Speed: 300 rpm

The specified speed rating of 300 rpm indicates the rotational speed capability of the microcontroller for specific applications.

No. of I/O Lines: 144

With 144 I/O lines, the microcontroller provides ample connectivity options for interfacing with external devices and components.

Technical Specifications

Microcontrollers AM1802BZCED3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

23

Bit Size:

32

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.3 mm

Speed:

300 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM1802BZCED3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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