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AFE3010AIRGTT

Texas Instruments

AFE3010AIRGTT by Texas Instruments

AFE3010AIRGTT by Texas Instruments is a Power Management IC with 16 terminals in a square package. It operates b/w -40 to 105°C, supporting power supply circuits with an adjustable threshold. The IC has a very thin profile and can handle peak reflow temperatures up to 260°C, making it suitable for industrial applications.

Median Price

$2.250

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 27 parts In-Stock

1+ parts

$2.920

100+ parts

$1.996

1k+ parts

-

10k+ parts

-

27

$2.920

$1.996

-

-

Mouser Electronics

USA . 194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.580

10k+ parts

$1.430

194

-

-

$1.580

$1.430

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$1.720

-

-

-

Digiode

USA . 3,503 parts In-Stock

1+ parts

$4.076

100+ parts

-

1k+ parts

-

10k+ parts

-

3,503

$4.076

-

-

-

Vyrian

USA . 6,712 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,712

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-

-

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VNN

France . 892 parts In-Stock

1+ parts

-

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-

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892

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 263 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

263

$1.340

-

-

-

Argo Parts USA

USA . 4,981 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

4,981

$1.720

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-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$1.720

-

-

-

Continental Prestige Electronics

USA . 856 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

$1.686

856

$1.720

-

-

$1.686

Corphita

USA . 3,748 parts In-Stock

1+ parts

$3.861

100+ parts

-

1k+ parts

-

10k+ parts

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3,748

$3.861

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AZTECH Wire

Italy . 537 parts In-Stock

1+ parts

$5.834

100+ parts

-

1k+ parts

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10k+ parts

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537

$5.834

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-

-

Parana Technologies

USA . 1,354 parts In-Stock

1+ parts

$7.624

100+ parts

$707.980

1k+ parts

$6.861

10k+ parts

-

1,354

$7.624

$707.980

$6.861

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DigiPath Technology Company

USA . 1,124 parts In-Stock

1+ parts

$8.395

100+ parts

-

1k+ parts

-

10k+ parts

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1,124

$8.395

-

-

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ChromeModa Solutions

Germany . 5,407 parts In-Stock

1+ parts

$8.566

100+ parts

$7.024

1k+ parts

-

10k+ parts

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5,407

$8.566

$7.024

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IDEA Electronic Components Group

UK . 1,119 parts In-Stock

1+ parts

$8.566

100+ parts

$8.138

1k+ parts

$7.709

10k+ parts

-

1,119

$8.566

$8.138

$7.709

-

Microchip USA

USA . 2,186 parts In-Stock

1+ parts

$15.010

100+ parts

$14.790

1k+ parts

$14.690

10k+ parts

$14.580

2,186

$15.010

$14.790

$14.690

$14.580

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,000

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Overview

Discover the cutting-edge AFE3010AIRGTT by Texas Instruments, a top-tier Power Management IC that delivers unmatched quality and reliability. Manufactured by the renowned Texas Instruments, this innovative chip offers exceptional performance and versatility in various applications. From industrial settings to consumer electronics, the AFE3010AIRGTT guarantees optimal power supply support with adjustable thresholds for seamless operation. Invest in this high-grade IC today and experience the value of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

No. of Terminals: 16

Having 16 terminals provides flexibility in connecting various components, enhancing the product's versatility.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures enables the product to perform reliably in both extreme cold and hot conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold for terminal finish ensures excellent conductivity and long-term reliability.

Width (mm): 3 mm

The compact width of the product allows for efficient use of space on the PCB.

Minimum Supply Voltage (Vsup): 0 V

The ability to support a minimum supply voltage of 0 V makes the product versatile for a wide range of applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate reliably in harsh industrial environments.

Maximum Supply Voltage (Vsup): 26 V

The high maximum supply voltage capability allows the product to be used in a variety of power supply applications.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility in customizing the product for different power management requirements.

Technical Specifications

Power Management ICs AFE3010AIRGTT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

26 V

Minimum Supply Voltage (Vsup):

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

AFE3010AIRGTT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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