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AFE2126E/1K

Texas Instruments

AFE2126E/1K by Texas Instruments

AFE2126E/1K by Texas Instruments is a digital transmission interface IC with 48 terminals, operating at 1.168 Mbps data rate and supporting power supplies of 3.3V and 5V. It is designed for industrial telecom applications, featuring CMOS technology, dual terminal position, and Gull Wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,468 parts In-Stock

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3,468

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Vyrian

USA . 2,501 parts In-Stock

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2,501

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Distributors (Availability)

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Parana Technologies

USA . 1,653 parts In-Stock

1+ parts

$9.807

100+ parts

-

1k+ parts

$10.376

10k+ parts

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1,653

$9.807

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$10.376

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DigiPath Technology Company

USA . 567 parts In-Stock

1+ parts

$10.799

100+ parts

$9.935

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-

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567

$10.799

$9.935

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ChromeModa Solutions

Germany . 5,751 parts In-Stock

1+ parts

$11.019

100+ parts

$9.036

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5,751

$11.019

$9.036

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IDEA Electronic Components Group

UK . 737 parts In-Stock

1+ parts

$11.019

100+ parts

$10.468

1k+ parts

$9.917

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737

$11.019

$10.468

$9.917

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AZTECH Wire

Italy . 265 parts In-Stock

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$17.104

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265

$17.104

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One Stop Electronics

USA . 1,513 parts In-Stock

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$36.000

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1,513

$36.000

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Ampacity Inc.

Singapore . 1,203 parts In-Stock

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$523.000

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1,203

$523.000

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Semicontronic

India . 371 parts In-Stock

1+ parts

$813.000

100+ parts

$792.675

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$788.610

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371

$813.000

$792.675

$788.610

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Corphita

USA . 4,258 parts In-Stock

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4,258

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Northwest PG Solutions

USA . 717 parts In-Stock

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717

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Corohmni

South Africa . 439 parts In-Stock

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439

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Native Components

USA . 429 parts In-Stock

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429

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Overview

Elevate your digital transmission interfaces with the AFE2126E/1K by Texas Instruments. Built with top-notch quality and precision, this product offers unmatched reliability and performance. Perfect for a wide range of applications in the telecom industry, this compact device delivers exceptional value and benefits to customers. Stay ahead of the competition with the cutting-edge technology and advantages that the AFE2126E/1K brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides high durability and resistance to environmental factors, making this product suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3,5

Support for both 3.3V and 5V power supplies offers flexibility in power requirements, enabling compatibility with various systems.

No. of Terminals: 48

Having 48 terminals provides ample connectivity options, allowing for versatile integration with other components in a system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand harsh environmental conditions and high levels of heat.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the reliability and efficiency of the product.

Technical Specifications

Digital Transmission Interfaces AFE2126E/1K attributes and parameters. Explore more Digital Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

1.168 Mbps

JESD-30 Code:

R-PDSO-G48

Length:

15.875 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP48,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

2.794 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

AFE2126E/1K Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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