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ADS8505IDBRG4

Texas Instruments

ADS8505IDBRG4 by Texas Instruments

ADS8505IDBRG4 by Texas Instruments is a 16-bit ADC with 0.0061% EL, 5V supply, and 0.25 MHz sample rate. Ideal for industrial applications, it features a CMOS technology, 2'S COMPLEMENT BINARY output code, and operates in the -40 to 85 °C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,887 parts In-Stock

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8,887

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Digiode

USA . 2,887 parts In-Stock

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2,887

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Distributors (Availability)

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AZTECH Wire

Italy . 205 parts In-Stock

1+ parts

$11.524

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205

$11.524

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Parana Technologies

USA . 887 parts In-Stock

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$11.902

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$12.300

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887

$11.902

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$12.300

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DigiPath Technology Company

USA . 646 parts In-Stock

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$13.106

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$12.057

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646

$13.106

$12.057

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ChromeModa Solutions

Germany . 6,974 parts In-Stock

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$13.373

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$10.966

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6,974

$13.373

$10.966

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IDEA Electronic Components Group

UK . 432 parts In-Stock

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$13.373

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$12.704

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$12.036

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432

$13.373

$12.704

$12.036

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One Stop Electronics

USA . 679 parts In-Stock

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$37.000

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679

$37.000

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Component Stockers USA

USA . 272 parts In-Stock

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$99.990

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Corphita

USA . 3,963 parts In-Stock

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Northwest PG Solutions

USA . 2,101 parts In-Stock

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Microchip USA

USA . 463 parts In-Stock

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Native Components

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Overview

Unlock the power of precise analog-to-digital conversion with the ADS8505IDBRG4 by Texas Instruments. Crafted with quality materials and cutting-edge technology, this ADC offers unparalleled accuracy and speed for industrial applications. With a compact design and high-resolution output, this converter ensures reliable performance in any environment. Trust Texas Instruments to deliver superior products that enhance your systems' efficiency and functionality. Upgrade your projects with the ADS8505IDBRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

No. of Bits: 16

With a high number of bits, this ADC can provide more precise digital conversion of analog signals.

Maximum Linearity Error (EL): 0.0061 %

The low linearity error ensures accurate conversion of analog signals to digital, maintaining data integrity.

Power Supplies (V): 5

Operating at 5V allows for compatibility with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can withstand harsh industrial environments without compromising performance.

Sample Rate: 0.25 MHz

The high sample rate allows for rapid conversion of analog signals, ensuring real-time data processing.

Technical Specifications

Analog-to-Digital Converters ADS8505IDBRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0061 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.2 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8505IDBRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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