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ADS8505IBDBR

Texas Instruments

ADS8505IBDBR by Texas Instruments

The Texas Instruments ADS8505IBDBR is a 16-bit ADC with 0.0023% linearity error, 5V power supply, and 0.25 MHz sample rate. Ideal for industrial applications requiring precise analog-to-digital conversion in a compact package. Features include small outline design, 2'S complement binary output, and -40 to 85°C operating temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,373 parts In-Stock

1+ parts

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3,373

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Vyrian

USA . 2,780 parts In-Stock

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2,780

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Bristol Electronics

USA . 1,041 parts In-Stock

1+ parts

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1,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 473 parts In-Stock

1+ parts

$0.084

100+ parts

-

1k+ parts

-

10k+ parts

$0.081

473

$0.084

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-

$0.081

Northwest PG Solutions

USA . 1,185 parts In-Stock

1+ parts

$0.092

100+ parts

-

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-

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$0.081

1,185

$0.092

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-

$0.081

AZTECH Wire

Italy . 876 parts In-Stock

1+ parts

$10.841

100+ parts

-

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876

$10.841

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One Stop Electronics

USA . 201 parts In-Stock

1+ parts

$15.000

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201

$15.000

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Parana Technologies

USA . 412 parts In-Stock

1+ parts

$15.171

100+ parts

-

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$15.569

10k+ parts

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412

$15.171

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$15.569

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DigiPath Technology Company

USA . 2,135 parts In-Stock

1+ parts

$16.705

100+ parts

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2,135

$16.705

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ChromeModa Solutions

Germany . 4,082 parts In-Stock

1+ parts

$17.046

100+ parts

$13.978

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4,082

$17.046

$13.978

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IDEA Electronic Components Group

UK . 115 parts In-Stock

1+ parts

$17.046

100+ parts

$16.194

1k+ parts

$15.341

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115

$17.046

$16.194

$15.341

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Component Stockers USA

USA . 455 parts In-Stock

1+ parts

$317.110

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455

$317.110

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QUARKTWIN TECHNOLOGY LTD

USA . 22,436 parts In-Stock

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22,436

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A-Z Elektronik GmbH

Germany . 6,090 parts In-Stock

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6,090

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Alle Elektronik GmbH

Germany . 4,060 parts In-Stock

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4,060

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Corphita

USA . 3,483 parts In-Stock

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3,483

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Metaverse IC Inc.

Canada . 2,500 parts In-Stock

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2,500

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Overview

Experience superior data conversion with the ADS8505IBDBR by Texas Instruments, a leading manufacturer in the field of Analog-to-Digital Converters. Perfect for industrial applications, this compact and efficient device offers high precision with minimal linearity error, ensuring accurate results every time. With a fast conversion time of just 2.2 microseconds and a wide operating temperature range, this ADC is versatile and reliable. Trust Texas Instruments for top-quality components that deliver exceptional value and performance to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring the long-term reliability of the product.

No. of Bits: 16

With 16 bits resolution, this Analog-to-Digital Converter (ADC) can provide precise and accurate digital representation of analog signals, making it suitable for high-precision applications.

Maximum Linearity Error (EL): 0.0023%

The low linearity error of 0.0023% ensures that the conversion from analog to digital signals is highly accurate, improving the overall performance of the ADC.

Power Supplies (V): 5

Operating at a standard 5V power supply, this ADC is convenient to use and compatible with common power sources, making it easy to integrate into various systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this ADC can withstand high temperature conditions, making it suitable for industrial applications where temperature fluctuations are common.

Technology: CMOS

The CMOS technology used in this ADC ensures low power consumption and high noise immunity, making it efficient and reliable for various digital signal processing applications.

Sample Rate: 0.25 MHz

With a high sample rate of 0.25 MHz, this ADC can capture and digitize signals quickly, making it suitable for applications that require real-time data conversion.

Technical Specifications

Analog-to-Digital Converters ADS8505IBDBR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

16

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Parallel, Word

Maximum Linearity Error (EL):

0.0023 %

Sample Rate:

250 kHz

Hold Mode:

Sample

Maximum Conversion Time:

2.2 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

-10 V

Maximum Analog Input Voltage:

10 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.75 V

Maximum Supply Current:

15 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

28

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.402 in (10.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP28,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G28

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8505IBDBR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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