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ADS8482IRGZR

Texas Instruments

ADS8482IRGZR by Texas Instruments

The Texas Instruments ADS8482IRGZR is an 18-bit ADC with 0.0015% EL, operating at 1 MHz sample rate. Ideal for industrial applications, it features a CMOS technology, 3/5.5V power supplies, and a quad-terminal form factor in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,116 parts In-Stock

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8,116

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Digiode

USA . 1,504 parts In-Stock

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1,504

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Distributors (Availability)

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Parana Technologies

USA . 2,348 parts In-Stock

1+ parts

$13.177

100+ parts

-

1k+ parts

$13.682

10k+ parts

-

2,348

$13.177

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$13.682

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DigiPath Technology Company

USA . 1,973 parts In-Stock

1+ parts

$14.510

100+ parts

$13.349

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-

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1,973

$14.510

$13.349

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ChromeModa Solutions

Germany . 2,941 parts In-Stock

1+ parts

$14.806

100+ parts

$12.141

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2,941

$14.806

$12.141

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IDEA Electronic Components Group

UK . 2,115 parts In-Stock

1+ parts

$14.806

100+ parts

$14.066

1k+ parts

$13.325

10k+ parts

-

2,115

$14.806

$14.066

$13.325

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AZTECH Wire

Italy . 357 parts In-Stock

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$17.168

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357

$17.168

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One Stop Electronics

USA . 1,593 parts In-Stock

1+ parts

$29.000

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1,593

$29.000

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Component Stockers USA

USA . 504 parts In-Stock

1+ parts

$99.990

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504

$99.990

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Corphita

USA . 3,651 parts In-Stock

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3,651

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Microchip USA

USA . 1,749 parts In-Stock

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1,749

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Native Components

USA . 859 parts In-Stock

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859

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Northwest PG Solutions

USA . 567 parts In-Stock

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567

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Overview

Unlock the power of precision with the ADS8482IRGZR by Texas Instruments, a top-of-the-line Analog-to-Digital Converter that delivers unparalleled accuracy and reliability. Crafted by the industry leader in semiconductor technology, this cutting-edge device is perfect for a wide range of applications, from industrial automation to medical equipment. Experience seamless performance and exceptional value with the ADS8482IRGZR, designed to exceed your expectations and elevate your projects to new heights. Choose Texas Instruments and revolutionize your digital solutions today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the Analog-to-Digital Converter.

No. of Bits: 18

With 18 bits, this ADC offers high resolution and accuracy in converting analog signals to digital data, making it suitable for precision applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this ADC to be used in a wide range of industrial environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with digital systems, making this ADC efficient and reliable.

Sample Rate: 1 MHz

The high sample rate of 1 MHz enables fast and accurate conversion of analog signals, making this ADC suitable for applications requiring real-time data processing.

Technical Specifications

Analog-to-Digital Converters ADS8482IRGZR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

18

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits, Parallel, Word

Maximum Linearity Error (EL):

0.0015 %

Sample Rate:

1 MHz

Hold Mode:

Sample

Maximum Conversion Time:

650 ns

Electrical Specifications

Power Supplies:

3/5,5 V

Minimum Analog Input Voltage:

-4.111 V

Maximum Analog Input Voltage:

4.111 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

48

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Shape:

Package Equivalence Code:

LCC48,.27SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N48

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

ADS8482IRGZR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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